HanElectricity HY-6AWT
Price:
Negotiable
MOQ:
800
Delivery Time:
7-15 working days
Brand:
HY-6AWT
Product Description
Product Specifications for ZH Series Connector Strip
This specification document outlines the product performance, test methods, and inspection requirements for the ZH series connector strip.
Applicable Standards:
- GB/T2421: Testing method for Environmental of Electrical Connectors Class 1: General Principles
- GB/T2423: Testing method for Environmental of Electrical Connectors
- GB/T2424: Testing method for Environmental of Electrical Connectors
- GB/T5095: Testing Procedure/method for components of electric equipment
Customer
HANYONES ELECTRONICS CO.,LTD
Project
2.0MM
Part No.
HY
Brand
HANYONES
Origin
Dongguan
| Item | Type | Material | Finish | Explanation |
|---|---|---|---|---|
| Terminal | Contact | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.20mm |
| Housing | Plastic Shell | Nylon66 UL94V-0 | Color: White | |
| Housing | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Straight Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Right Angle Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PBT UL94V-0 | Color: White | |
| Wafer | Position Right Angle Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Plastic Shell | PA46 UL94V-0 | Color: Beige | |
| Wafer | Horizontal Mount Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Solder Tab | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.25mm |
| Wafer | Plastic Shell | PA6T UL94V-0 | Color: Beige | |
| Wafer | Vertical Mount Pin | Brass | Tin Plating: 2.5~5m | Thickness: 0.50mm |
| Wafer | Solder Tab | Phosphor bronze | Tin Plating: 3~5m | Thickness: 0.25mm |
| No. | Item | Test Mode | Requirement |
|---|---|---|---|
| 6.1 | Current Rated | 1A AC DC | |
| 6.2 | Voltage Rated | 100V AC DC | |
| 6.3 | Contact Resistance | Mate connector, max test voltage 20mV, max test current 100mA | Initial value 20m (excluding wire resistance) |
| 6.4 | Withstand Voltage | Mate connectors, 500V AC (rms) for 1 minute between adjacent terminals to ground, leakage current 0.5mA | No breakdown or flashover |
| 6.5 | Insulation Resistance | Between adjacent contacts, 500V DC for 1 minute | 500 M |
| 7.1 | Terminal crimping wire strength | AWG#26 wire, pullout force at 253mm/min | 20N |
| AWG#28 wire, pullout force at 253mm/min | 13N | ||
| AWG#30 wire, pullout force at 253mm/min | 8N | ||
| AWG#32 wire, pullout force at 253mm/min | 6N | ||
| 7.2 | Fixed terminals and hole seat | Terminal pulled from hole seat at 253mm/min along wire direction | Per contact: 10N |
| 7.3 | Single contact insertion force | Housing with terminal matched with wafer, insertion force at 253mm/min | 6N |
| 7.4 | Single contact withdrawal force | Housing with terminal matched with wafer, withdrawal force at 253mm/min | 0.6N |
| 7.5 | Pin Retention force | Force applied to pin end at 253mm/min until pin exits seat | Per contact: 10N |
| 7.6 | Durability | Mate connectors up to 30 cycles (max 10 cycles/min) before environmental test | Contact Resistance 30 m |
| 7.7 | Vibration | Connector combination on PCB, vibration test (10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis: Y, X, Z) | Appearance: No damage, Contact Resistance 30 m, Current Discontinuity: 1sec Max |
| 8.1 | Thermal Aging | Mate connector in oven at 852 for 96 hours continuously | Appearance: No damage, Contact Resistance 30 m |
| 8.2 | Temperature Rise | Mate connector at maximum rated current | 30 Max |
| 8.3 | Humidity | Mate connector at 402, 90-95%RH for 96 hours continuously | Appearance: No damage, Contact Resistance 30m, Insulation Resistance 250M, No breakdown or flashover |
| 8.4 | Temperature Cycling | Connectors tested with 5 cycles: (-553, 30min -> Room temp. 10-15min) and (853, 30min -> Room temp. 10-15min) | Same as paragraph 8.3 |
| 8.5 | Salt Spray | Connectors tested with salt spray (353, 51% solution) | Stamping after tin plated: 8 hours; Stamping before tin plated: 24 hours. Appearance: No damage, Contact Resistance 30 m |
| 8.6 | Solder ability | Immersion in solder at 2455 for 30.5S | Area of Soldering: 90% |
| 8.7 | Resistance to soldering heat | Manual soldering: 30.5S at 3505; Wave soldering: 50.5S at 2305; Reflow soldering: 20S Max at 2555 | Appearance: No damage |
| No. | Item | Details |
|---|---|---|
| 9.1 | SMT Lead-free Process Temperature Curve | Refer to temperature curve diagram (not provided in text) |
| Section | Description |
|---|---|
| 10.1 Packaging | Terminal: disc loading material packaging. Plastic shell: plastic bags. Wafer: disc loading, bag loading. Includes certificate with product name, specs, quantity, production date. Exterior: carton with packing list. Product must not shift in box. |
| 10.2 Transportation | Any vehicle. Avoid direct rain/sun, collision, extrusion. Transport temperature: -20~+50. |
| 10.3 Storage | (Details not provided in text) |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales