Phoenix Contact 1156833
Price:
Negotiable
MOQ:
900
Delivery Time:
12-13 weeks
Brand:
1156833
Product Description
Product Overview
This SMD socket, featuring a reliable double-sided contact system, is designed for seamless integration into SMT soldering processes. It offers clear and cost-optimized design suitable for a multitude of applications, ensuring reliable mechanical and electrical connections. The female strip is manufactured with a gold-plated contact surface for enhanced conductivity and durability.
Product Attributes
- Brand: Phoenix Contact
- Product Type: SMD socket
- Product Family: FQ 1,27D/...-SV
- Contact Surface Material: Gold (Au)
- Housing Color: Black (9005)
- Insulating Material: PA
- Insulating Material Group: I
- CTI (Comparative Tracking Index): 600 (according to IEC 60112)
- Flammability Rating: V0 (according to UL 94)
- WEEE/RoHS-compliant: Yes
- Country of Origin: CN
- Approvals: cULus Recognized (Approval ID: E118976)
- ESD level: (D) electrostatically conductive (according to DIN EN 61340-5-1)
Technical Specifications
| Specification | Value |
|---|---|
| Item Number | 1156833 |
| Product Key | AAXAAF |
| GTIN | 4063151160517 |
| Number of Positions | 10 |
| Pitch | 1.27 mm |
| Number of Rows | 2 |
| Pin Layout | Linear pad geometry |
| Nominal Current (IN) | 1 A (at 20C 80-pos.) |
| Test Voltage | 500 V AC (IEC 60512-4-1:2003-05) |
| Contact Resistance | 20 m |
| Width [w] | 6.75 mm |
| Height [h] | 5.1 mm |
| Length [l] | 4.5 mm |
| Installed Height | 4.6 mm |
| Stack Height | 6.2 mm |
| Wipe Length | 1.3 mm |
| Pad Geometry | 0.76 x 2.05 mm |
| Contact Material | Cu alloy |
| Contact Surface (top layer) | Gold (Au) |
| Contact Surface (middle layer) | Nickel (Ni) |
| Soldering Area (top layer) | Tin (Sn) |
| Insulation Resistance (neighboring positions) | > 1 G (IEC 60512-3-1:2002-02) |
| Insertion Strength per pos. | approx. 1.2 N |
| Withdraw Strength per pos. | approx. 1.2 N |
| No. of cycles (Durability) | 100 |
| Ambient Temperature (operation) | -40 C ... 125 C |
| Ambient Temperature (storage/transport) | -40 C ... 70 C |
| Relative Humidity (storage/transport) | 30 % ... 70 % |
| Ambient Temperature (assembly) | -5 C ... 100 C |
| Mounting Type | SMD soldering |
| Processing Type | Reflow soldering |
| Moisture Sensitive Level (MSL) | 1 |
| Classification Temperature (Tc) | 260 C |
| Tape width [W] | 16 mm |
| Coil overall dimension [W2] | 22.4 mm |
| Coil diameter [A] | 330 mm |
| Nominal Voltage (UN) (cULus) | 30 V |
| Nominal Current (IN) (cULus) | 1 A |
| ECLASS-11.0 | 27460201 |
| ECLASS-12.0 | 27460201 |
| ECLASS-13.0 | 27460201 |
| ETIM 9.0 | EC002637 |
| UNSPSC 21.0 | 39121400 |
| EU RoHS | Fulfills EU RoHS substance requirements (Yes, No exemptions) |
| China RoHS EFUP | No hazardous substances above the limits |
| REACH SVHC | No substance above 0.1 wt% |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales