JST PHR-6-BK
Price:
Negotiable
MOQ:
20000
Delivery Time:
16-18 weeks
Brand:
PHR-6-BK
Product Description
PH Connector 2.0mm Pitch
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, a printed circuit board retention mechanism, and surface mount models (SMT).
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, Certified LR20812, R75087
- RoHS Compliant: Yes
Technical Specifications
| Model No. | Circuits | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / Reel | Material and Finish | Dimensions (mm) A | Dimensions (mm) B | Q'ty / Box | Material | Type |
| PHR-2 to PHR-16 | 2-16 | - | - | - | 1,000 | PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.8 to 33.8 | 1,000 | - | - |
| SPH-002T-P0.5S | - | 0.05 0.22 | 3024 | 0.91.5 | 8,000 | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact |
| SPH-002T-P0.5L | - | 0.08 0.22 | 2824 | 0.81.5 | 10,000 | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact (Low Insertion Force) |
| SPH-004T-P0.5S | - | 0.0320.08 | 3228 | 0.50.9 | - | Phosphor bronze, tin-plated (reflow treatment) | - | - | - | - | Contact |
| S2B-PH-K-S to S16B-PH-K-S | 2-16 | - | - | - | - | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Top Entry Type |
| B2B-PH-K-S to B16B-PH-K-S | 2-16 | - | - | - | - | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Side Entry Type |
| S2B-PH-KL to S16B-PH-KL | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Top Entry Type (Low Insertion Force) |
| B2B-PH-KL to B16B-PH-KL | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | 2.0 to 30.0 | 5.9 to 33.9 | 1,000 (2-6 circuits), 500 (7-11 circuits), 400 (12-16 circuits) | - | Side Entry Type (Low Insertion Force) |
| B2B-PH-SM4-TB to B16B-PH-SM4-TB | 2-16 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 2.0 to 30.0 | 7.95 to 35.95 | 1,000 | - | SMT Type Top Entry |
| S2B-PH-SM4-TB to S15B-PH-SM4-TB | 2-15 | - | - | - | - | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | 2.0 to 28.0 | 7.9 to 33.9 | 1,000 | - | SMT Type Side Entry |
Specifications
- Current rating: 2A AC, DC (AWG #24)
- Voltage rating: 100V AC, DC
- Temperature range: -25C to +85C (including temperature rise in applying electrical current)
- Contact resistance: Initial value/ 10m max. After environmental testing/ 20m max.
- Insulation resistance: 1,000M min.
- Withstanding voltage: 800V AC/ minute
- Applicable wire: AWG #32 to #24
- Applicable PC board thickness: 0.8 to 1.6mm
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales