TE Connectivity 2-87608-1
Price:
Negotiable
MOQ:
192
Delivery Time:
24-28 weeks
Brand:
2-87608-1
Product Description
Product Overview
The TE Connectivity AMPMODU Headers 2-87608-1 is a vertical, board-to-board PCB mount header designed for parallel configurations. It features a fully shrouded design with 50 positions and a 2.54 mm [.1 in] centerline pitch. This header is constructed with gold-plated contacts over a nickel-plated copper alloy, ensuring reliable signal transmission with a maximum current rating of 3 A. The through-hole solder termination method provides a secure connection to the PCB. Ideal for signal applications, this header offers robust mechanical features including detent window mating retention and polarization for accurate assembly.
Product Attributes
- Brand: TE Connectivity
- Series: AMPMODU Headers
- Internal #: 2-87608-1
- Product Type: PCB Mount Header
- Connector System: Board-to-Board
- Housing Material: Nylon-GF
- Primary Product Color: Black
- Contact Base Material: Phosphor Bronze
- Contact Mating Area Plating Material: Gold
- Contact Underplating Material: Nickel
- Contact Type: Pin
- Termination Method to Printed Circuit Board: Through Hole - Solder
- Mating Retention Type: Detent Window
- Mating Alignment Type: Polarization
- Housing Temperature Rating: Standard
- Agency/Standard: CSA, UL
- UL Flammability Rating: UL 94V-0
- Packaging Quantity: 24
- Packaging Type: Tray
- EU RoHS Directive: 2011/65/EU Compliant
- EU ELV Directive: 2000/53/EC Compliant
- China RoHS 2 Directive: MIIT Order No 32, 2016
- EU REACH Regulation: Compliant (No Restricted Materials Above Threshold)
- Halogen Content: BFR/CFR/PVC Free, but Br/Cl >900 ppm in other sources.
- Solder Process Capability: Wave solder capable to 240C
Technical Specifications
| Specification | Value |
|---|---|
| Number of Rows | 2 |
| Number of Positions | 50 |
| Connector System | Board-to-Board |
| PCB Mount Orientation | Vertical |
| PCB Connector Assembly Type | PCB Mount Header |
| Header Type | Fully Shrouded |
| Connector Contact Load Condition | Fully Loaded |
| Insulation Resistance | 5000 M |
| Dielectric Withstanding Voltage (Max) | 750 Vrms |
| Connector Profile | Standard |
| Mating Square Post Dimension | .64 mm[.025 in] |
| Contact Mating Area Plating Material Thickness | .762 m[30 in] |
| Contact Current Rating (Max) | 3 A |
| Termination Post & Tail Dimension | .64 mm[.025 in] |
| Termination Post & Tail Length | 8.38 mm[.33 in] |
| Mating Retention | With |
| Mating Alignment | With |
| PCB Mount Retention | Without |
| PCB Mount Alignment | Without |
| Connector Mounting Type | Panel Mount |
| Centerline (Pitch) | 2.54 mm[.1 in] |
| Row-to-Row Spacing | 2.54 mm[.1 in] |
| PCB Thickness (Recommended) | 1.57 mm[.062 in] |
| Operating Temperature Range | -65 105 C[-85 221 F] |
| Circuit Application | Signal |
| Approved Standards | CSA LR7189, UL E28476 |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales