JST PADP-16V-1-S
Price:
Negotiable
MOQ:
1
Delivery Time:
1 working day
Brand:
PADP-16V-1-S
Product Description
Product Overview
The PAD CONNECTOR is a disconnectable crimp style connector with a 2.0mm pitch and dual-row construction for high-density mounting. It features a secure locking device, reliable contacts, an insertion guide mechanism, and a polarizing boss.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, 2R50053749
- RoHS Compliance: RoHS2
Technical Specifications
| Component | Model No. | Circuits | Pitch (mm) | Current Rating (A) | Voltage Rating (V) | Wire Gauge (AWG#) | Temperature Range (C) | Contact Resistance (m) | Insulation Resistance (M) | Withstanding Voltage (VAC/min) | PC Board Thickness (mm) | Material | Finish | Insulation O.D. (mm) | Q'ty/ reel | Q'ty/ bag |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Housing | PADP-10V-1-S | 10 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 10 |
| Housing | PADP-12V-1-S | 12 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 12 |
| Housing | PADP-14V-1-S | 14 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 14 |
| Housing | PADP-16V-1-S | 16 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 16 |
| Housing | PADP-20V-1-S | 20 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 20 |
| Housing | PADP-22V-1-S | 22 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 22 |
| Housing | PADP-24V-1-S | 24 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 24 |
| Housing | PADP-40V-1-S | 40 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 500 | 40 |
| Contact | SPH-001T-P0.5L | - | - | 3 | 250 | #26 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Phosphor bronze | tin-plated (reflow treatment) | 0.130.33 | 8,000 | - |
| Contact | SPH-002T-P0.5L | - | - | 3 | 250 | #28 to #24 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Phosphor bronze | tin-plated (reflow treatment) | 0.080.22 | 8,000 | - |
| Contact | SPND-001T-C0.5 | - | - | 3 | 250 | #26 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Copper alloy | tin-plated (reflow treatment) | 0.130.33 | 8,000 | - |
| Contact | SPND-002T-C0.5 | - | - | 3 | 250 | #28 to #24 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Copper alloy | tin-plated (reflow treatment) | 0.080.22 | 8,000 | - |
| Shrouded header | S10B-PADSS-1 | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 504 |
| Shrouded header | S12B-PADSS-1 | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 420 |
| Shrouded header | S14B-PADSS-1 | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 364 |
| Shrouded header | S16B-PADSS-1 | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 336 |
| Shrouded header | S20B-PADSS-1 | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 280 |
| Shrouded header | S24B-PADSS-1 | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 224 |
| Shrouded header | B10B-PADSS-F | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 400 |
| Shrouded header | B12B-PADSS-F | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B14B-PADSS-F | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B16B-PADSS-F | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 200 |
| Shrouded header | B20B-PADSS-F | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B22B-PADSS-F | 22 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B24B-PADSS-F | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B10B-PADSS-1F | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 400 |
| Shrouded header | B12B-PADSS-1F | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B14B-PADSS-1F | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B16B-PADSS-1F | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 200 |
| Shrouded header | B20B-PADSS-1F | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B22B-PADSS-1F | 22 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B24B-PADSS-1F | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B40B-PADSS-1F | 40 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 100 |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales