JST XAP-03V-1
Price:
Negotiable
MOQ:
10
Delivery Time:
1 working day
Brand:
XAP-03V-1
Product Description
Product Overview
The JST XA Connector High Box Type is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers high mounting height and thickness, ensuring robust connections.
Product Attributes
- Brand: JST
- Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
- Material (Housing): PA 66, UL94V-0, natural (white)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Post/Wafer): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
- Certifications: UL Recognized E60389, CSA Certified LR20812
- Compliance: RoHS
Technical Specifications
| Product Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / bag | Q'ty / reel | Q'ty / box | Material |
|---|---|---|---|---|---|---|---|---|
| Header (High Box Type) | XMS-XXV | 2-15 | 2.5 to 35.0 | - | 1,000 | - | - | Glass-filled PA 66, UL94V-0, natural (ivory) |
| Housing (Standard Type) | XAP-XXV-1 | 2-15 | 2.5 to 35.0 | 7.3 to 39.8 | 1,000 | - | - | PA 66, UL94V-0, natural (white) |
| Housing (Retainer Mountable Type) | XARP-XXV | 2-15 | 2.5 to 35.0 | 9.8 to 42.3 | 1,000 (2-13), 500 (14-15) | - | - | PA 66, UL94V-0, natural (white) |
| Contact | SXA-001T-P0.6 | - | - | - | 8,000 | - | - | Phosphor bronze, tin-plated (reflow treatment) |
| Shrouded Header (Without a boss) | BHXXB-XASK-BN | 2-15 | 2.5 to 35.0 | 7.5 to 40.0 | - | - | 400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header (With a boss) | BHXXB-XASK | 2-15 | 2.5 to 35.0 | 10.0 to 42.5 | - | - | 400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on Radial Tape (Without a boss) | BHXXB-XASS-BN-T | 2-8 | 2.5 to 17.5 | 7.5 to 22.5 | - | - | 1,000 (2-3), 500 (4-8) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on Radial Tape (With a boss) | BHXXB-XASS-T | 2-8 | 2.5 to 17.5 | 10.0 to 25.0 | - | - | 1,000 (2-3), 500 (4-8) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
General Specifications
| Specification | Value |
|---|---|
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. / After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable Wire | AWG #28 to #22 |
| Applicable PC Board Thickness | 1.6mm |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales