HRS BM24-24DP/2-0.35V(51)
Price:
Negotiable
MOQ:
10
Delivery Time:
Negotiable
Brand:
BM24-24DP/2-0.35V(51)
Product Description
BM24 Series: Hybrid Power/Signal Connectors
The BM24 Series offers 0.35mm pitch, 0.8mm height hybrid power and signal connectors designed for board-to-board and FPC-to-board applications. These connectors provide a compact solution for integrating power and signal transmission.
Brand
HIROSE ELECTRIC CO., LTD.
Series Name
BM
Series Number
24
Pitch
0.35mm
Height
0.8mm
Insulator Material
LCP (UL94V-0)
Signal Contact Material
Phosphor bronze
Power Contact Material
Copper alloy
Plating
Gold plated
Connector Type
Receptacle (DS) / Header (DP)
Termination Type
Straight SMT (V)
Packaging
Embossed tape (10,000 pcs/reel)
| Item | Specifications | Conditions | Value |
|---|---|---|---|
| Insulation resistance | 100M min. | Measured at 100V DC | |
| Withstanding voltage | No flashover or dielectric breakdown | 150V AC for one minute | |
| Contact resistance (Signal) | 100m max. | Measured at 20mV AC, 1kHz, and 1mA | |
| Contact resistance (Power) | 15m max. | Measured at 20mV AC, 1kHz, and 1mA | |
| Vibration | Insulation resistance: 50M min. Contact resistance: Signal 100m max., Power 15m max. No electrical discontinuity for more than 1s. | Frequency: 10 to 55 Hz ; half amplitude: 0.75mm, in 3 axis directions for 2 hours | |
| Humidity | Contact resistance: Signal 100m max., Power 15m max. | 96 hours at 40C and 90 to 95% humidity | |
| Temperature cycle | Contact resistance: Signal 100m max., Power 15m max. Insulation resistance: 100M min. | (-55C for 30 min 5 to 35C for 10 min 85C for 30 min 5 to 35C for 10 min) in 5 cycles | |
| Durability | Contact resistance: Signal 100m max., Power 15m max. | 10 mating cycles | |
| Solder heat resistance | No dissolution or melting of resin affecting performance. | Reflow: with recommended profile; Hand soldering: 350C max. for 3 seconds |
| Rating | Value | Unit | Condition |
|---|---|---|---|
| Rated current (Power contact) | 5 | A | |
| Rated current (Signal contact) | 0.25 | A | (Note 1) |
| Rated voltage | 30 | V AC/DC | |
| Operating temperature range | -40 to 85 | C | (Note 2) |
| Storage temperature range | -10 to 60 | C | (Note 3) |
| Operating humidity range | 20 to 80 | % | |
| Storage humidity range | -15 to 70 | % | (Note 3) |
Notes
- Note 1: The total current capacity for connectors with 40 or more signal contacts is 10A for all contacts.
- Note 2: Includes temperature rise caused by current flow.
- Note 3: Storage refers to long-term storage of unused items before mounting. Operating temperature/humidity range applies to temporary storage after mounting and during transportation.
Product Number Structure Example
BM24 - % DS / 2 - 035 V (51)
- @ Series Name: BM
- @ Series No.: 24
- @ Connector type: DS (Receptacle), DP (Header)
- @ Number of Power Contacts: 2
- @ Number of Signal Contacts: 10, 20, 24, 30, 40
- @ Contact Pitch: 0.35mm
- @ Termination type: V (Straight SMT)
- @ Gold plated specification and packaging status: (51) Gold plate thickness 0.05m, Embossed tape packaging (10,000 pcs/reel)
Precautions
- Recommended solder temperature profile: Peak 250C, Heat section 220C min. (60 sec), Preheat section 150-180C (90-120 sec), Max 2 reflow cycles.
- Recommended manual soldering: 340 10C for within 3 seconds.
- Recommended stencil thickness: 0.1mm. Aperture ratio: 80% (DS), 70% (DP).
- Board warpage: Max 0.02mm at the center relative to ends.
- Cleaning is not recommended. If performed, evaluate performance first.
- Care when mating/unmating to avoid contact damage.
- Avoid supporting PCB solely with connectors.
- Do not apply excessive prying force during mating/unmating.
- Avoid flux wicking during hand soldering.
- Slight color differences are possible due to lot variability but do not affect performance.
- Secure mated connectors to the board with housings and cushioning materials to prevent disengagement from drops or impacts.
- Do not use in non-recommended conditions (rated current, voltage, environment).
- Consult Hirose for use under conditions other than specified.
- When mating, position correctly and apply force without horizontal movement.
- When unmating, pull in a straight line. If difficult, pull obliquely with adequate FPC support.
- Avoid unmating by a corner.
- Ensure FPC has a stiffener (e.g., glass epoxy min. 0.3mm, stainless steel min. 0.2mm).
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales