Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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HRS DF11-8DS-2DSA(05)

Price Negotiable
Price: Negotiable
MOQ: 500
Delivery Time: 14-26 weeks
Brand: DF11-8DS-2DSA(05)
Product Description

Product Overview

The DF11 Series offers a 2.0mm pitch, double-row connector compliant with UL/CSA safety standards. These connectors are designed for reliable wire-to-board and crimp applications.

Brand

Brand

HIROSE ELECTRIC CO., LTD.

Certifications

Certifications

UL/CSA Compliant
ItemWire SizeRated Current (Note 1)Rated VoltageOperating Temperature RangeOperating Humidity RangeStorage Temperature RangeStorage Humidity Range
General22 to 26 AWG (Crimping)2A250V AC-30 to +85C (Note 2)40 to 80% (Note 3)-10 to +60C (Note 4)40 to 70% (Note 4)
Insulation Displacement28 AWG1A100V AC
Insulation Displacement30 AWG0.5A
Insulation Displacement26 AWG1A
ItemConditionSpecificationValue
Insulation Resistance500V DC1000M Min.
Withstanding Voltage650V AC for 1 min.No flashover or insulation breakdown.
Contact Resistance100mA30m Max.
Single Insertion/Extraction Force0.3N (30gf) Min. to 4.4N (450gf) Max.Measured by the square steel pin at 0.5+ 0.002mm
VibrationNo electrical discontinuity of 1 s or moreFrequency: 10 to 55Hz, single amplitude of 0.75mm, 2 hours in each of the 3 directions.
Humidity (Steady State)402C, 90 to 95% RH, 96 hoursContact Resistance: 30m Max., Insulation Resistance: 500M Min.
Temperature Cycle5 cycles (-55C: 30 min -> 5 to 35C: 10 min -> 85C: 30 min -> 5 to 35C: 10 min)Contact Resistance: 30m Max., Insulation Resistance: 1000M Min.
Mating DurabilityContact Resistance: 30m Max.Tin Plated: 30 cycles, Gold Plated: 50 cycles
Resistance to Soldering HeatFlow260C for 10 seconds
Resistance to Soldering HeatManual soldering (Through Hole)300C for 2 seconds
Resistance to Soldering HeatManual soldering (SMT)300C for 3 seconds
Resistance to Soldering HeatReflow (SMT)At the SMT recommended temperature profile
Soldering Condition (SMT)Recommended TemperatureRecommended Time
Soldering iron290 10CWithin 2 seconds
ItemSpecification
Screen Thickness (SMT)0.15 to 0.2mm
Board Warpage (SMT)Max. 0.03mm in the connector center area (based on both connector edges)
Recommended Flow Soldering (Through-hole)250C for 10 seconds
Manual Soldering (Through-hole)Soldering iron temperature 290 10C for 2 seconds
Cleaning ConditionRefer to the "Wire-to-Board Connector Use Handbook".
Connection ConditionRefer to the "Wire-to-Board Connector Use Handbook".

Precautions

  • When inserting the crimp terminal into the IDC socket, do not insert diagonally to maintain performance reliability.
  • Refer to DF11 Series Cable Assembly Procedure (ETAD-H0965-00), DF11#-##SC##(##) Crimp Quality Standard (ETAD-HO773-00), DF11#-EP####PC##(##) (ETAD-H0935-00) and Crimp Condition for cable assembly procedures.
  • Refrain from insertion and removal when not mounted to the board as it may result in damage or deformation of the contacts.
  • Do not remove the product by holding the cable as it may result in damage.
  • When soldering by hand, do not apply flux that may result in flux rising.
  • There may be slight variation in mold coloration based on production lot, but this does not affect product performance.

Handling Instructions

  • Refer to the following documents when handling this product: Crimp Quality Standard (ETAD-H0773-00, ETAD-H0835-00), Cable Assembly Procedure (ETAD-H0965-00), Wire-to-Board Connector Use Handbook.

General Notes

  • Specifications mentioned in this catalog are reference values. When considering to order or use this product, please confirm the "Drawing" and "Product Specifications" sheets.
  • Use an appropriate cable when using the connector in combination with cables. If considering usage of a non-specified cable, please contact your sales representative.
  • If assembly process is done by jigs & tools which are not identified by Hirose, assurance will not be given.
  • Please consult with your Hirose sales representative if you are planning to use the product for any of the following applications: Automotive, medical, public infrastructure, aerospace/defense, etc.
  • Hirose will consider the validity of the warranty depending on the conditions.
  • The contents of this catalog are current as of date of 3/2021. Contents are subject to change without notice for the purpose of improvements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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