HRS DF11-8DS-2DSA(06)
Product Overview
The DF11 Series connectors are double-row, 2.0mm pitch connectors designed for reliable wire-to-board connections. They are UL/CSA compliant, offering a robust solution for various electronic applications. These connectors support both SMT (Surface Mount Technology) and Through-hole mounting methods, with specific recommendations for soldering conditions, screen thickness, and board warpage to ensure optimal performance and reliability. They are suitable for applications requiring high reliability, such as automotive, medical instruments, public infrastructure, and aerospace/defense, though consultation with Hirose is recommended for such critical uses.
Brand
HIROSE ELECTRIC CO., LTD.
Product Series
DF11 Series
Pitch
2.0mm
Configuration
Double-Row Connector
Certifications
UL/CSA Compliant
Origin
JAPAN
| Item | Specification | Condition | Wire Size | Rated Current (Pin) | Rated Voltage | Operating Temperature Range | Storage Temperature Range | Insulation Resistance | Withstanding Voltage | Contact Resistance | Single Insertion/Extraction Force | Vibration | Humidity (Steady State) | Temperature Cycle | Mating Durability | Resistance to Soldering Heat (SMT) | Resistance to Soldering Heat (Through-hole) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| General | DF11 Series | UL/CSA Compliant | 22 to 26 AWG | 2A/pin (22 AWG) | 250V AC/DC | -30 to +85C | -10 to +60C | 1000M Min. (500V DC) | 650V AC for 1 min. | 30m Max. (100mA) | 0.3N (30gf) Min. / 4.4N (450gf) Max. | No discontinuity of 1s or more | Contact Resistance: 30m Max. / Insulation Resistance: 500M Min. (40C, 90-95% RH, 96 hours) | Contact Resistance: 30m Max. / Insulation Resistance: 1000M Min. (-55C to 85C, 5 cycles) | Tin Plated: 30 cycles / Gold Plated: 50 cycles | 300C for 3 seconds | 300C for 2 seconds |
| Crimping Ratings | 28 AWG | 1A/pin | |||||||||||||||
| Crimping Ratings | 30 AWG | 0.5A/pin | |||||||||||||||
| UL/CSA Specs | 22 AWG | 2A/pin | 30V AC/DC | ||||||||||||||
| UL/CSA Specs | 24 to 28 AWG | 1A/pin | 30V AC/DC | ||||||||||||||
| UL/CSA Specs | 30 AWG | 0.5A/pin | 30V AC/DC |
| Soldering Iron Temperature (SMT) | Soldering Time (SMT) | Screen Thickness (SMT) | Board Warpage (SMT) | Recommended Flow Soldering (Through-hole) | Manual Soldering Condition (Through-hole) |
|---|---|---|---|---|---|
| 290 10C | Within 2 seconds | 0.15 to 0.2mm | 0.03mm Max. in center area | 2505C for 10 seconds | 290 10C for 2 seconds |
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