JST XAP-04V-1
Price:
Negotiable
MOQ:
10
Delivery Time:
1 working day
Brand:
XAP-04V-1
Product Description
Product Overview
The JST XA Connector High Box Type is a disconnectable crimp style connector designed for 2.5mm pitch applications. It is specifically engineered for use with resin-coated (potted) PC boards, offering a high box type configuration with a mounting height of 19.5mm and a thickness of 6.9mm. This connector ensures reliable electrical connections with high current and voltage ratings, suitable for a wide temperature range.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, CSA Certified LR20812
- RoHS Compliant: Yes
Technical Specifications
| Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Material | Q'ty / bag | Notes |
| Header (High box type) | XMS-02V to XMS-15V | 2-15 | 2.5 to 35.0 | - | Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000 | With a boss / Without a boss |
| Header (Standard type) | XAP-02V-1 to XAP-15V-1 | 2-15 | 2.5 to 35.0 | 7.3 to 39.8 | PA 66, UL94V-0, natural (white) | 1,000 | Standard type |
| Header (Retainer mountable type) | XARP-02V to XARP-15V | 2-15 | 2.5 to 35.0 | 9.8 to 42.3 | PA 66, UL94V-0, natural (white) | 1,000 | Retainer mountable type |
| Contact | SXA-001T-P0.6 | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 8,000 / reel | Applicable wire: AWG #28 to #22, Insulation O.D. (mm): 0.6 |
| Shrouded header (Without a boss) | BH02B-XASK to BH15B-XASK | 2-15 | 2.5 to 35.0 | 7.5 to 40.0 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 400-100 | - |
| Shrouded header (With a boss) | BH02B-XASK-BN to BH15B-XASK-BN | 2-15 | 2.5 to 35.0 | 10.0 to 42.5 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 400-100 | - |
| Shrouded header on radial-tape (Without a boss) | BH02B-XASS-T to BH08B-XASS-T | 2-8 | 2.5 to 17.5 | 7.5 to 22.5 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000-500 | Taping specifications |
| Shrouded header on radial-tape (With a boss) | BH02B-XASS-BN-T to BH08B-XASS-BN-T | 2-8 | 2.5 to 17.5 | 10.0 to 25.0 | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) | 1,000-500 | Taping specifications |
| Specification | Value |
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax., After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable PC board thickness | 1.6mm |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales