JST XARP-06V
Price:
Negotiable
MOQ:
1
Delivery Time:
1 working day
Brand:
XARP-06V
Product Description
JST XA Connector, High Box Type
The JST XA Connector, High Box Type, is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers a high box type with a mounting height of 19.5mm and a thickness of 6.9mm, providing robust connection solutions.
Product Attributes
- Brand: JST
- Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
- Material (Housing): PA 66, UL94V-0, natural (white)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Post/Wafer - Shrouded Header): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
- Certifications: UL Recognized E60389, CSA Certified LR20812
- RoHS Compliance: Yes
Technical Specifications
| Product Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / bag / reel / box | Material |
|---|---|---|---|---|---|---|
| Header (High box type) | XMS-02V to XMS-15V | 2 to 15 | 2.5 to 35.0 | - | 1,000 | Glass-filled PA 66, UL94V-0, natural (ivory) |
| Housing (Standard type) | XAP-02V-1 to XAP-15V-1 | 2 to 15 | 2.5 to 35.0 | 7.3 to 39.8 | 1,000 | PA 66, UL94V-0, natural (white) |
| Housing (Retainer mountable type) | XARP-02V to XARP-15V | 2 to 15 | 2.5 to 35.0 | 9.8 to 42.3 | 1,000 (2-13 circuits), 500 (14-15 circuits) | PA 66, UL94V-0, natural (white) |
| Contact | SXA-001T-P0.6 | - | - | - | 8,000 / reel | Phosphor bronze, tin-plated (reflow treatment) |
| Shrouded Header (Without a boss) | BH02B-XASK to BH15B-XASK | 2 to 15 | 2.5 to 35.0 | 7.5 to 40.0 | 400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header (With a boss) | BH02B-XASK-BN to BH15B-XASK-BN | 2 to 15 | 2.5 to 35.0 | 10.0 to 42.5 | 400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on radial-tape (Without a boss) | BH02B-XASS-T to BH08B-XASS-T | 2 to 8 | 2.5 to 17.5 | 7.5 to 22.5 | 1,000 (2-3 circuits), 500 (4-8 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
| Shrouded Header on radial-tape (With a boss) | BH02B-XASS-BN-T to BH08B-XASS-BN-T | 2 to 8 | 2.5 to 17.5 | 10.0 to 25.0 | 1,000 (2-3 circuits), 500 (4-8 circuits) | Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory) |
General Specifications
| Parameter | Specification |
|---|---|
| Pitch | 2.5mm |
| Current Rating | 3A AC, DC (AWG #22) |
| Voltage Rating | 250V AC, DC |
| Temperature Range | -25C to +85C |
| Contact Resistance | Initial: 10mmax. After environmental testing: 20mmax. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 1,000V AC/minute |
| Applicable Wire | AWG #28 to #22 |
| Applicable PC Board Thickness | 1.6mm |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales