Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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JST XARP-06V

Price Negotiable
Price: Negotiable
MOQ: 1
Delivery Time: 1 working day
Brand: XARP-06V
Product Description

JST XA Connector, High Box Type

The JST XA Connector, High Box Type, is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers a high box type with a mounting height of 19.5mm and a thickness of 6.9mm, providing robust connection solutions.

Product Attributes

  • Brand: JST
  • Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
  • Material (Housing): PA 66, UL94V-0, natural (white)
  • Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
  • Material (Post/Wafer - Shrouded Header): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
  • Certifications: UL Recognized E60389, CSA Certified LR20812
  • RoHS Compliance: Yes

Technical Specifications

Product TypeModel No.CircuitsDimensions (mm) ADimensions (mm) BQ'ty / bag / reel / boxMaterial
Header (High box type)XMS-02V to XMS-15V2 to 152.5 to 35.0-1,000Glass-filled PA 66, UL94V-0, natural (ivory)
Housing (Standard type)XAP-02V-1 to XAP-15V-12 to 152.5 to 35.07.3 to 39.81,000PA 66, UL94V-0, natural (white)
Housing (Retainer mountable type)XARP-02V to XARP-15V2 to 152.5 to 35.09.8 to 42.31,000 (2-13 circuits), 500 (14-15 circuits)PA 66, UL94V-0, natural (white)
ContactSXA-001T-P0.6---8,000 / reelPhosphor bronze, tin-plated (reflow treatment)
Shrouded Header (Without a boss)BH02B-XASK to BH15B-XASK2 to 152.5 to 35.07.5 to 40.0400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header (With a boss)BH02B-XASK-BN to BH15B-XASK-BN2 to 152.5 to 35.010.0 to 42.5400 (2-3 circuits), 300 (4-5 circuits), 200 (6-8 circuits), 150 (9-10 circuits), 100 (11-15 circuits)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header on radial-tape (Without a boss)BH02B-XASS-T to BH08B-XASS-T2 to 82.5 to 17.57.5 to 22.51,000 (2-3 circuits), 500 (4-8 circuits)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header on radial-tape (With a boss)BH02B-XASS-BN-T to BH08B-XASS-BN-T2 to 82.5 to 17.510.0 to 25.01,000 (2-3 circuits), 500 (4-8 circuits)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)

General Specifications

ParameterSpecification
Pitch2.5mm
Current Rating3A AC, DC (AWG #22)
Voltage Rating250V AC, DC
Temperature Range-25C to +85C
Contact ResistanceInitial: 10mmax. After environmental testing: 20mmax.
Insulation Resistance1,000M min.
Withstanding Voltage1,000V AC/minute
Applicable WireAWG #28 to #22
Applicable PC Board Thickness1.6mm

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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