Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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TE Connectivity 103361-4

Price Negotiable
Price: Negotiable
MOQ: 2088
Delivery Time: 25-42 weeks
Brand: 103361-4
Product Description

Product Overview

Product Name: PCB Mount Header, Right Angle, Board-to-Board, 6 Position, 2.54 mm [.1 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, AMPMODU Headers

Application: Signal

Description: This is a PCB Mount Header designed for Board-to-Board connections. It features a right-angle orientation, 6 positions, and a 2.54 mm [.1 in] centerline. The header is fully shrouded, gold-plated, and uses a through-hole solder termination method. It is part of the AMPMODU Headers series.

Product Name: 103361-4
Brand: AMPMODU Headers
Industry Standards: CSA LR7189, UL E28476
Flammability Rating: UL 94v-0
Packaging Quantity: 29
Packaging Type: Tube
EU RoHS Directive: Not Compliant
EU ELV Directive: Not Compliant
China RoHS 2 Directive: Restricted Materials Above Threshold
EU REACH Regulation: Current ECHA Candidate List: JUNE 2023 (235), Candidate List Declared Against: JUNE 2023 (235), SVHC > Threshold: Pb (40% in Component Part)
Halogen Content: BFR/CFR/PVC Free, but Br/Cl >900 ppm in other sources.
Solder Process Capability: Wave solder capable to 240C
Primary Product Color: Black
Contact Base Material: Phosphor Bronze
Contact Type: Pin
Connector Mounting Type: Board Mount
Housing Material: Thermoplastic
PCB Thickness (Recommended): 1.4 mm[.055 in]
Housing Temperature Rating: Standard
Operating Temperature Range: -65 - 105 C[-85 - 221 F]
Part Number Centerline (Pitch) Number of Positions Number of Rows Contact Plating Contact Termination Area Plating Thickness Contact Mating Area Plating Thickness Termination Method Square Termination Post & Tail Dimension Termination Post & Tail Length Mating Alignment Type PCB Mount Retention Connector Shell Size PCB Contact Termination Area Plating Material Contact Underplating Material Contact Base Material Contact Mating Area Plating Material Contact Current Rating (Max) Housing Material Row-to-Row Spacing Operating Temperature Range
103361-4 2.54 mm [.1 in] 6 N/A Gold 5.08 um [100 - 200 in] 762 um [30 in] Through Hole - Solder 0.64 mm [.025 in] 2.79 mm [.11 in] Without Without N/A Tin-Lead Nickel Phosphor Bronze Gold 3A Thermoplastic 2.54 mm [.1 in] -65 - 105 C [-85 - 221 F]
5745886-1 2.74 mm [.108 in] 25 2 N/A N/A N/A N/A N/A N/A N/A N/A 3 N/A N/A N/A Tin N/A Thermoplastic N/A N/A

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Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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