JST ZER-04V-S
Price:
Negotiable
MOQ:
5
Delivery Time:
1 working day
Brand:
ZER-04V-S
Product Description
Product Overview
The ZE CONNECTOR series offers 1.5mm pitch disconnectable crimp style connectors designed for secure mating. Key features include a secure locking structure and contact locking structure, providing a reliable connection. The fork-shaped header contact ensures a good mating feel and secure operation. These connectors are suitable for applications requiring a compact and robust connection solution.
Brand
JST
Series
ZE Connector
Type
1.5mm pitch / Disconnectable Crimp style connectors
Certifications
Recognized E60389
Compliance
RoHS compliant
Packaging
Emboss Tape, Qty/ bag, Qty/ reel, Qty/ box
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ bag | Material |
|---|---|---|---|---|---|
| ZER-02V-S | 2 | 1.5 | 3.0 | 6,000 | PBT, UL94V-0, natural |
| ZER-03V-S | 3 | 3.0 | 4.5 | 6,000 | PBT, UL94V-0, natural |
| ZER-04V-S | 4 | 4.5 | 6.0 | 5,000 | PBT, UL94V-0, natural |
| ZER-05V-S | 5 | 6.0 | 7.5 | 3,000 | PBT, UL94V-0, natural |
| ZER-06V-S | 6 | 7.5 | 9.0 | 3,000 | PBT, UL94V-0, natural |
| ZER-07V-S | 7 | 9.0 | 10.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-08V-S | 8 | 10.5 | 12.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-09V-S | 9 | 12.0 | 13.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-10V-S | 10 | 13.5 | 15.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-11V-S | 11 | 15.0 | 16.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-12V-S | 12 | 16.5 | 18.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-13V-S | 13 | 18.0 | 19.5 | 2,000 | PBT, UL94V-0, natural |
| ZER-14V-S | 14 | 19.5 | 21.0 | 2,000 | PBT, UL94V-0, natural |
| ZER-15V-S | 15 | 21.0 | 22.5 | 1,500 | PBT, UL94V-0, natural |
| ZER-16V-S | 16 | 22.5 | 24.3 | 1,500 | PBT, UL94V-0, natural |
| Model No. | Applicable wire (AWG#) | Applicable wire (mm) | Insulation O.D. (mm) | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| SZE-002T-P0.3 | 2824 | 0.080.21 | 0.761.2 | 16,000 | Copper alloy, tin-plated (reflow treatment) |
| SZE-003T-P0.3 | 3026 | 0.050.13 | 0.761.0 | 16,000 | Copper alloy, tin-plated (reflow treatment) |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ box | Material and Finish |
|---|---|---|---|---|---|
| B02B-ZESK-1D | 2 | 1.5 | 6.0 | 2,496 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B03B-ZESK-1D | 3 | 3.0 | 7.5 | 1,984 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B04B-ZESK-1D | 4 | 4.5 | 9.0 | 1,664 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B05B-ZESK-1D | 5 | 6.0 | 10.5 | 1,408 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B06B-ZESK-1D | 6 | 7.5 | 12.0 | 1,216 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B07B-ZESK-1D | 7 | 9.0 | 13.5 | 1,088 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B08B-ZESK-1D | 8 | 10.5 | 15.0 | 960 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B09B-ZESK-1D | 9 | 12.0 | 16.5 | 896 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B10B-ZESK-1D | 10 | 13.5 | 18.0 | 832 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B11B-ZESK-1D | 11 | 15.0 | 19.5 | 768 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B12B-ZESK-1D | 12 | 16.5 | 21.0 | 704 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B13B-ZESK-1D | 13 | 18.0 | 22.5 | 640 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B14B-ZESK-1D | 14 | 19.5 | 24.0 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B15B-ZESK-1D | 15 | 21.0 | 25.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B16B-ZESK-1D | 16 | 22.5 | 27.0 | 512 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B03B-ZESK-D | 3 | 3.0 | 7.5 | 1,984 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B04B-ZESK-D | 4 | 4.5 | 9.0 | 1,664 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B05B-ZESK-D | 5 | 6.0 | 10.5 | 1,408 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B06B-ZESK-D | 6 | 7.5 | 12.0 | 1,216 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B07B-ZESK-D | 7 | 9.0 | 13.5 | 1,088 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B08B-ZESK-D | 8 | 10.5 | 15.0 | 960 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B09B-ZESK-D | 9 | 12.0 | 16.5 | 896 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B10B-ZESK-D | 10 | 13.5 | 18.0 | 832 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B11B-ZESK-D | 11 | 15.0 | 19.5 | 768 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B12B-ZESK-D | 12 | 16.5 | 21.0 | 704 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B13B-ZESK-D | 13 | 18.0 | 22.5 | 640 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B14B-ZESK-D | 14 | 19.5 | 24.0 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B15B-ZESK-D | 15 | 21.0 | 25.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| B16B-ZESK-D | 16 | 22.5 | 27.0 | 512 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S02B-ZESK-2D | 2 | 1.5 | 6.0 | 1,872 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S03B-ZESK-2D | 3 | 3.0 | 7.5 | 1,488 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S04B-ZESK-2D | 4 | 4.5 | 9.0 | 1,248 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S05B-ZESK-2D | 5 | 6.0 | 10.5 | 1,056 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S06B-ZESK-2D | 6 | 7.5 | 12.0 | 912 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S07B-ZESK-2D | 7 | 9.0 | 13.5 | 816 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S08B-ZESK-2D | 8 | 10.5 | 15.0 | 720 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S09B-ZESK-2D | 9 | 12.0 | 16.5 | 672 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S10B-ZESK-2D | 10 | 13.5 | 18.0 | 624 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S11B-ZESK-2D | 11 | 15.0 | 19.5 | 576 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S12B-ZESK-2D | 12 | 16.5 | 21.0 | 528 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S13B-ZESK-2D | 13 | 18.0 | 22.5 | 480 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S14B-ZESK-2D | 14 | 19.5 | 24.0 | 432 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S15B-ZESK-2D | 15 | 21.0 | 25.5 | 432 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| S16B-ZESK-2D | 16 | 22.5 | 27.0 | 384 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Glass-filled PA 66, UL94V-0, natural |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| SM02B-ZESS-TB | 2 | 1.5 | 7.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM03B-ZESS-TB | 3 | 3.0 | 9.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM04B-ZESS-TB | 4 | 4.5 | 10.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM05B-ZESS-TB | 5 | 6.0 | 12.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM06B-ZESS-TB | 6 | 7.5 | 13.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM07B-ZESS-TB | 7 | 9.0 | 15.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM08B-ZESS-TB | 8 | 10.5 | 16.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM09B-ZESS-TB | 9 | 12.0 | 18.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM10B-ZESS-TB | 10 | 13.5 | 19.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM11B-ZESS-TB | 11 | 15.0 | 21.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM12B-ZESS-TB | 12 | 16.5 | 22.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM13B-ZESS-TB | 13 | 18.0 | 24.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM14B-ZESS-TB | 14 | 19.5 | 25.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM15B-ZESS-TB | 15 | 21.0 | 27.0 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| SM16B-ZESS-TB | 16 | 22.5 | 28.5 | 1,000 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Qty/ reel | Material and Finish |
|---|---|---|---|---|---|
| BM02B-ZESS-TBT | 2 | 1.5 | 7.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM03B-ZESS-TBT | 3 | 3.0 | 9.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM04B-ZESS-TBT | 4 | 4.5 | 10.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM05B-ZESS-TBT | 5 | 6.0 | 12.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM06B-ZESS-TBT | 6 | 7.5 | 13.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM07B-ZESS-TBT | 7 | 9.0 | 15.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM08B-ZESS-TBT | 8 | 10.5 | 16.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM09B-ZESS-TBT | 9 | 12.0 | 18.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM10B-ZESS-TBT | 10 | 13.5 | 19.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM11B-ZESS-TBT | 11 | 15.0 | 21.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM12B-ZESS-TBT | 12 | 16.5 | 22.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM13B-ZESS-TBT | 13 | 18.0 | 24.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM14B-ZESS-TBT | 14 | 19.5 | 25.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM15B-ZESS-TBT | 15 | 21.0 | 27.0 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
| BM16B-ZESS-TBT | 16 | 22.5 | 28.5 | 800 | Contact: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: Polyamide, UL94V-0, natural Reinforcement: Copper alloy, copper-undercoated, tin-plated (reflow treatment) |
Specifications
- Current rating: 2 A AC, DC (AWG #24)
- Voltage rating: 100 V AC, DC
- Temperature range: -25C to +85C (including temperature rise in applying electrical current)
- Contact resistance: Initial value/ 20 mmax. After environmental tests/ 40 mmax.
- Insulation resistance: 500 Mmin.
- Withstanding voltage: 500 VAC/minute
- Applicable wire: Conductor size/ AWG #30 to #24, Insulation O.D./ 0.76 to 1.2 mm
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales