JST PHR-2
Price:
Negotiable
MOQ:
10
Delivery Time:
1 working day
Brand:
PHR-2
Product Description
PH Connector 2.0mm Pitch
This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount Model (SMT).
Product Attributes
- Brand: JST
- Material (Wafer): PA 66, UL94V-0
- Material (Header Post): Brass, copper-undercoated, tin-plated (reflow treatment) or Copper alloy, copper-undercoated, tin-plated (reflow treatment)
- Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
- Material (Solder tab): Brass, copper-undercoated, tin-plated (reflow treatment)
- Color (Wafer): Natural (white), natural (ivory), gray
- Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
- Compliance: RoHS
Technical Specifications
| Model Type | Model No. | Circuits | Dimensions (mm) A | Dimensions (mm) B | Q'ty / box | Material and Finish | Applicable Wire (mm) | Applicable Wire (AWG) | Insulation O.D. (mm) | Q'ty / reel |
| Contact | SPH-002T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.05 0.22 | 3024 | 0.91.5 | 8,000 |
| Contact | SPH-002T-P0.5L | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) (Low insertion force type) | 0.08 0.22 | 2824 | 0.81.5 | 10,000 |
| Contact | SPH-004T-P0.5S | - | - | - | - | Phosphor bronze, tin-plated (reflow treatment) | 0.0320.08 | 3228 | 0.50.9 | - |
| Receptacle | PHR-2 | 2 | 2.0 | 5.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - |
| Receptacle | PHR-16 | 16 | 30.0 | 33.8 | 1,000 | PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Top entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Top entry) | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Side entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole) | PH-K-S (Side entry) | 16 | 30.0 | 33.9 | 250 | Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white) | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Top entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Top entry) | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Side entry) | 2 | 2.0 | 5.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (Through-hole, Low insertion force type) | PH-KL (Side entry) | 16 | 30.0 | 33.9 | 250 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Top entry) | 2 | - | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Top entry) | 16 | - | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Side entry) | 2 | - | 7.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
| Header (SMT) | PH-SM4-TB (Side entry) | 16 | - | 33.9 | 1,000 | Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment) | - | - | - | - |
Specifications
| Parameter | Value |
| Pitch | 2.0mm |
| Current Rating | 2A AC, DC (AWG #24) |
| Voltage Rating | 100V AC, DC |
| Temperature Range | -25C to +85C (including temperature rise in applying electrical current) |
| Contact Resistance | Initial value/ 10m max. After environmental testing/ 20m max. |
| Insulation Resistance | 1,000M min. |
| Withstanding Voltage | 800V AC/ minute |
| Applicable wire | AWG #32 to #24 |
| Applicable PC board thickness | 0.8 to 1.6mm |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales