Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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Samtec CLP-105-02-L-D-P-TR

Price Negotiable
Price: Negotiable
MOQ: 1375
Delivery Time: 12-16 working days
Brand: CLP-105-02-L-D-P-TR
Product Description

Product Overview

This document details a series of low-profile, double-row surface mount connectors, specifically the CLP series. These connectors are designed for applications requiring compact form factors and reliable electrical connections. They offer various plating options for contact areas and tails, along with specialized options like alignment pins, pick and place pads, and polyimide film pads for automated assembly and enhanced mechanical stability.

Key Features:

  • Low profile design
  • Double row configuration
  • Surface mount lead style
  • Multiple plating options for durability and conductivity
  • Options for automated assembly (Pick & Place, Polyimide Film Pads)
  • Alignment pins for precise mating

Applications:

Ideal for board-to-board interconnects in space-constrained environments, consumer electronics, industrial automation, and telecommunications equipment.

Brand Samtec
Product Series CLP
Body Specification Double Row (CLP-XX-D)
Lead Style Specification Surface Mount (C-106-X2-XXX or SUB-C-106-X2-XXX)
Insulator Material LCP, UL 94 V0, Color: Black
Contact Material Phosphor Bronze
Standard Pitch 0.050" (1.27mm)
Part Number Suffix Description Contact Area Plating Tail Plating Notes
-F Standard 3" Flash Selective Gold Matte Tin
-L Standard 10" Light Selective Gold Matte Tin
-S Standard 30" Selective Gold Matte Tin
-G Standard 10" Gold 3" Gold
-H Standard 30" Heavy Gold 3" Gold
-LM Standard 10" Light Selective Gold Matte Tin
-FM Standard 3" Flash Selective Gold Matte Tin
-SM Standard 30" Selective Gold Matte Tin
-LTL Standard 10" Light Selective Gold Tin/Lead (90/10+/-5%) See Note 9
-STL Standard 30" Selective Gold Tin/Lead (90/10+/-5%) See Note 9
-A Alignment Pin N/A N/A Not available with -PA option. See Fig 2, Sht 2. Min 3 positions.
-BE Bottom Entry Only N/A N/A Use CLP-XX-DBE-XX. See Fig 1.
-P Pick & Place Pad N/A N/A Use LMP-01. Available on positions -05 thru -50 only. Not available with -PA or -K options. See Fig 3, Sht 2.
-PA Pick & Place Pad with Alignment Pins N/A N/A Not available with -P, -A, or -K options. See Sht 2, Table 3. See Note 12. Must ship in -TR, -FR or trays.
-K Polyimide Film Pad N/A N/A Available on -03 thru -50 positions (use K-DOT-.157-.250-.005). Available on -02 positions (use K-DOT-.118-.219-.005). See Fig 5, Sht 2. Not available with -P or -PA options.
(Blank) Packaging Option N/A N/A Tubes. Standard packaging. See Notes 16 & 17.
-TR Packaging Option N/A N/A Tape and Reel. See Notes 17 & 18.
-FR Packaging Option N/A N/A Full Reel Qty. Tape & Reel. See Notes 17 & 18.
Number of Positions Dimensions (Body) Dimensions (Lead Tail) Notes
-02 thru -50 (No. of Pos x .0500[1.270]) + .017[0.43] .008[0.20] See Section "A"-"A" and "B"-"B" on Sheet 1
Option Description Dimensions Notes
-P Pick and Place Pad See Fig 3, Sht 2 Available on positions -05 thru -50 only. Not available with -PA or -K options.
-PA Pick & Place Pad with Alignment Pins See Fig 4, Sht 2 Not available with -P, -A or -K options. See Sht 2, Table 3. See Note 12.
-K Polyimide Film Pad See Fig 5, Sht 2 Available on position -05 thru -50 only. Not available with -P or -PA options.
Option Description Dimensions Notes
-A Alignment Pin See Fig 2, Sht 2 3 position minimum. Not available with -PA option.

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Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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