Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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HRS BM22-6S-V(51)

Price Negotiable
Price: Negotiable
MOQ: 10000
Delivery Time: 7-14 working days
Brand: BM22-6S-V(51)
Product Description

BM22 Series4A Micro Hybrid FPC-to-Board Connectors

The BM22 Series connectors are designed for FPC-to-board applications, offering a micro hybrid solution for compact electronic devices. They provide reliable electrical connections for both power and signal contacts.

Usage Recommendations:

  • Soldering: Follow recommended reflow or manual soldering profiles to ensure proper connection without damaging components.
  • Stencil Thickness: Use recommended stencil thickness and open area ratios for optimal solder paste application.
  • Board Warpage: Ensure minimal board warpage around the connector mounting area.
  • Cleaning: Cleaning is not recommended as it may affect mating/un-mating operations. If cleaning is necessary, verify functionality afterward.
  • Handling Precautions: Do not mate or un-mate connectors until they are mounted on the PCB. Avoid excessive twisting forces during mating/un-mating. Provide adequate support to the PCB.

Brand

HIROSE ELECTRIC

Series

BM22 Series4A

Type

Micro Hybrid FPC-to-Board Connectors

Insulator Material

LCP

Insulator Color

Black

Contact Material

Copper alloy

Contact Finish

Gold plated

UL Standard

UL94V-0

Packaging Types

Embossed tape packaging (10,000pcs/reel, 1,000pcs/reel)

ItemSpecificationConditionsSignal ContactPower Contact
Insulation resistanceMin of 100 MMeasured at 100V DC--
Withstanding voltageNo flashover or insulation breakdownConduct 150V AC for 1 minute--
Contact resistanceMax of 50 mMeasured at 20mV AC, 1kHz, 1mAMax of 50 mMax of 30 m
VibrationNo electrical discontinuity of 1s or longerFrequency: 10 to 55Hz, single amplitude of 0.75mm, 10 cycles in each of 3 axis directions for 5 minutes / cycle--
Humidity-96 hours at 402C and 90 to 95% RHInsulation resistance: Min of 50 M-
Temperature cycle--55C (30 min) 85C (30 min), 5 cyclesContact resistance: Max of 50 m, Insulation resistance: Min of 100 MContact resistance: Max of 30 m
Durability-10 mating cyclesContact resistance: Max of 50 mContact resistance: Max of 30 m
Solder Heat ResistanceNo signs of melting or deformity on molded resin partsReflow: According to Recommended Solder Profile; Hand soldering: 350C, max 3 seconds--
ItemSpecificationConditions
Operating temperature range-35 to 85CNote 1: Includes temperature rise caused by current flow.
Storage temperature range-10 to 60CNote 2: Refers to products stored prior to board mounting.
Operating humidity range20 to 80% RH-
Storage humidity range44 to 70% RHNote 2: Refers to products stored prior to board mounting.
Product Number StructureDescription
BM 22 -Series name: BM 22 / BM 22L
- %Number of contacts: 4 (2 signal, 2 power) / 6 (4 signal, 2 power)
o oConnector type: S (Receptacle) / P (Header)
S -V (1)Termination type: V (Straight), O (SMT)
e oGold plated
oSpecification and packaging status: (51) Gold plate thickness 0.05m, Embossed tape packaging (10,000pcs/reel); (53) Gold plate thickness 0.05m, Embossed tape packaging (1,000pcs/reel)

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Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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