Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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TE Connectivity 2199249-4

Price Negotiable
Price: Negotiable
MOQ: 60000
Delivery Time: 25-42 weeks
Brand: 2199249-4
Product Description

Product Overview

The TE Connectivity Low Force Scalable Spring Finger is designed to meet stringent performance, test, and quality assurance requirements. It offers reliable electrical, mechanical, and environmental performance suitable for various applications.

Brand TE Connectivity
Origin Shanghai, China
Document ID 108-115061-1
Revision A2
Specification Type A Type B & C Unit
Material SUS301 Copper alloy
Under plating Ni 2m MIN
Contact Area Plating Gold 0.5m MIN
Soldering Area Plating Gold Flash
Voltage Rating 15 Max. V
Current Rating 2.0 A
Operating Temperature Range -30 to 85 C
Storage Temperature Range -5 to 85 C
Storage Humidity Range 15 to 70 %RH
Test Requirement Procedure/Standard
Low level contact resistance (Initial) 25 m Max (Type B/C), 75 m Max (Type A) EIA 364-23
Low level contact resistance (Final) 50 m Max (Type B/C), 100 m Max (Type B/C) EIA 364-23
Temperature rise 30C max increase EIA 364-70, Method 2
Damp heat No change to performance; CR: Max. 50m (Cu), 100m (SST); Normal Force performance IEC 60068-2-30 Db
Vibration No mechanical damage; No change to performance; Discontinuity <1s; Max. 50m IEC60068-2-64Fh
Shock No mechanical damage; No change to performance; Discontinuity <1s; Max. 50m IEC60068-2-27Ea
Nitric Acid Vapour test See Document ID: DTY11017-EN-2.0 IEC 600068-2-78
Solderability Min. 95% solder coverage 2453, 2-3 sec
Resistance to reflow soldering heat No cosmetic damage; Meet subsequent test requirements Figure 1, 3 reflow cycles
Thermal shock No change to performance; CR: Max. 50m (Cu), 100m (SST); Normal Force performance IEC 68-2-14-N
Contact force (min deflection) 0.2 Min. Measured from return curve, after 3 reflow cycles
Contact force (max deflection) 1 20% Max. Measured from return curve, after 3 reflow cycles
Durability (Life cycle) No functional damage; CR: 50m Max.; Normal force meets spec 5000 cycles @ 20 matings/min
Durability (Spring dynamic test) No functional damage; CR: 50m Max.; Normal force meets spec; Max. 20% loss of initial force 10000 cycles @ 20 matings/min
Peeling Strength 3 N (Type A&B), 9 N (Type C) Figure 4
Push Strength 10 N Min. Figure 3

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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