TE Connectivity 60824-1
Price:
Negotiable
MOQ:
140000
Delivery Time:
25-42 weeks
Brand:
60824-1
Product Description
This document outlines specifications for a printed circuit board (PCB) component, focusing on plating and material requirements. It details gold plating in specific areas, tin plating on the remainder, and nickel underplating. Solderability is also a key consideration.
Brand Not specified
Origin Not specified
Material Nickel, Tin, Gold
Certifications Not specified
| Feature | Specification | Minimum | Maximum | Notes |
|---|---|---|---|---|
| Gold Plating | In specified areas | 0.00122 in | - | (0.03122 mm) |
| Tin Plating | On remainder | 0.00122 in | - | (0.03122 mm) |
| Nickel Underplate | Under Gold and Tin | 0.03122 in | - | (0.793 mm) |
| Diameter Hole | For applicator | 1.57 | - | (0.0618 in) |
| Solderability | Communication | 11-3 | - | - |
| Dimension | Value | Unit |
|---|---|---|
| Diameter Opening Required | 8.00 | g.28 (likely 0.28) |
| Max Dimension | 7.54 | - |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales