HRS DF59-4P-2C
Price:
Negotiable
MOQ:
100
Delivery Time:
4-6 working days
Brand:
DF59-4P-2C
Product Description
Low Profile Interconnect System
Developed for LED applications, this system offers an ultra-low profile design that minimizes shadowing. It features a unique "Swing-lock" engagement for strong plug retention against cable pull and high current capability of 3 Amps. The floating Board-to-Board connector with "Stress free contact" allows for 0.5 mm floating in XYZ directions, enabling multiple Board-to-Board connections to minimize thermal expansion issues. It is RoHS compliant and cUL Pending.
Key Features:
- Ultra low profile design minimizes shadowing.
- Wire-to-Board, Board-to-Board, and Short-Circuit applications are compatible with a common header.
- Positive "Swing-lock" engagement provides strong plug retention.
- High current capability: 3 Amps.
- Floating Board-to-Board connector with "Stress free contact" allows 0.5 mm floating in XYZ directions.
- Multiple Board-to-Board connections minimize thermal expansion issues.
- Temperature range: -35C to 105C.
- For AWG #22: 1.2 to 1.45 mm diameter.
Brand
HIROSE
Certifications
cUL Pending
Compliance
RoHS compliant
Temperature Range
-35C to 105C
| Part Number | Positions | Type | Gender | Pitch (mm) | Depth (mm) | Width (mm) | Height (mm) |
|---|---|---|---|---|---|---|---|
| OFS9-45-2V(51) | 4 | Header | Female | 2.30 | 2.80 | 2.48 | 2.80 |
| OFS9-40-2FC(50) | 4 | e2B bridge | Female | 2.30 | 2.80 | 2.48 | 2.80 |
| OFS9-22pCPA | Contact | Male | 2.30 | 2.80 | 2.48 | 2.80 |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales