Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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CINCH DB-59-20

Price Negotiable
Price: Negotiable
MOQ: 12
Delivery Time: 10-15 working days
Brand: DB-59-20
Product Description

Product Overview

Cinch D-subminiature connectors are a popular choice for I/O applications across various industries including computer, telecom, datacom, medical, test instrumentation, military, and aerospace. They offer reliable connectivity with options for printed circuit board mounting (vertical and right-angle) and cable assemblies or wire harnesses (crimp and poke, solder cup, insulation displacement, wire wrap). Available in multiple series, including high-reliability options, these connectors are designed for durability and performance.

Product Attributes

  • Brand: Cinch
  • Parent Company: Bel Fuse Inc.
  • Certifications: UL Recognition (Files E170218, E130965), CSA Approval (File LR31996)
  • Contact Plating Options: Gold Flash, 30in. gold, 50in. gold
  • Shell Plating Options: Zinc plating (yellow or clear chromate), Tin plating, Cadmium plating (yellow chromate finish for military grade)
  • Insulator Materials: Glass-filled polyester, Glass-filled nylon, Diallyl phthalate
  • Available Positions: 9, 15, 25, 37, 50
  • Wire Gauge Compatibility: Up to 20 AWG (Solder Cup), 20-24 AWG (Crimp and Poke), 24-28 AWG (IDC)

Technical Specifications

Feature/Series Description Positions Contact Plating Shell Type Operating Temperature Durability Current Rating
D*U Series Crimp and Poke Metal Shell, Crimp and Poke for discrete wire. 9, 15, 25, 37, 50 Gold Flash or 30in. gold Zinc-plated, Tin-plated -65C to +105C 500 mating cycles 5 Amps
T* Series All-Plastic IDC All-Plastic IDC for discrete wire. 9, 15, 25, 37 Gold flash or 30in. gold N/A (All-Plastic) -65C to +125C 500 mating cycles 3 Amps
Basic D Series Solder Cup Metal Shell, Solder Cup for wire termination. 9, 15, 25, 37, 50 Gold Flash Zinc-plated, Tin-plated -65C to +125C 500 mating cycles 5 Amps
Basic D Series Vertical Dip Solder PCB Metal Shell, Vertical PCB Mount with Dip Solder tails. 9, 15, 25, 37, 50 Gold flash or 30in. gold Zinc-plated, Tin-plated -65C to +125C 500 mating cycles 5 Amps
Basic D Series Wire Wrap Metal Shell, Wire Wrap termination. 9, 15, 25, 37, 50 Gold flash Zinc-plated, Tin-plated -65C to +125C 500 mating cycles 5 Amps
Series 1 - High Reliability Solder Cup Metal Shell, Solder Cup, Monoblock diallyl phthalate insulator. 9, 15, 25, 37, 50 30in gold over nickel Zinc-plated, Tin-plated -65C to +125C 500 mating cycles 5 Amps
Series 3 - High Reliability Crimp and Poke Metal Shell, Crimp and Poke, Monoblock diallyl phthalate insulator. 9, 15, 25, 37, 50 30in gold over nickel Zinc-plated, Tin-plated -65C to +125C 500 mating cycles 5 Amps
M24308 Series MIL-C-24308 Metal Shell, meets MIL-C-24308 Class G. Available in Crimp and Poke, Solder Cup, Vertical PCB, Right-Angle PCB. 9, 15, 25, 37, 50 (Right-angle: 9-37) 50in gold over copper or nickel Cadmium plating (yellow chromate) -65C to +125C 500 mating cycles 5 Amps
Panel Mounting Specifications Refer to pages 5-6 for detailed dimensions (A, B, C, D, E, F, H) for various shell sizes and positions.
Shell Dimensions Refer to page 6 for detailed shell dimensions (A, B, B1, C, D, D1, E, G, H, J, K, L, M) for various shell sizes and positions.
PCB Layout Dimensions Refer to pages 7-9 for PCB thickness chart, layout dimensions, and footprints.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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