Ckmtw R-RJ45S08P-B200
Price:
Negotiable
MOQ:
1
Delivery Time:
1 working day
Brand:
R-RJ45S08P-B200
Product Description
Product Information
This document outlines the technical specifications for a PC board component, including material, electrical, mechanical, and environmental details. It also provides layout information for the component side of the PC board.
Housing Material
GLASS FILLED POLYESTER UL94\V-C
Contact Material
PHOSPHOR BRONZE t=0.30mm
Plating
SELECTING GOLD PLATING 3u~50u" OVER NICKEL
| Specification | Value |
|---|---|
| Voltage Rating | 125 VAC RMS |
| Current Rating | 1.5 AMP |
| Contact Resistance | 30 MILLIOHMS MAX |
| Insulation Resistance | 500 MEGOHMS MIN @ 500V DC |
| Dielectric Withstanding Resistance | 1000V AC RMS @ 60Hz, 1min |
| Durability | 750 CYCLES MIN |
| PCB Retention Pre-solder | 1 LB MIN |
| Storage Temperature | -40C to 108C |
| Operation Temperature | 0C to 70C |
| TOLERANCE | 0.030 | 0.000 | 0.005 | 0.000 | 0.000 | 0.000 |
|---|---|---|---|---|---|---|
| R-RJ45-6P/BC | 1X2 | XURMA | M% | WEM | ERK | Amor |
| R-RJ45508P-5200 | 2000049 | V1is | e | L |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales