TE Connectivity 2301844-2
Price:
Negotiable
MOQ:
1
Delivery Time:
1 working day
Brand:
2301844-2
Product Description
Product Overview
This specification covers performance, tests, and quality requirements for D-sub right angle and vertical printed circuit board mounted connectors. Applicable product descriptions and part numbers are as shown on the product drawing.
BrandAMPLIMITE*
Product TypePCB Mounted Connectors
Qualification Test Report501-32048
| Specification | Requirement | Procedure |
|---|---|---|
| Initial examination of product | Meets requirements of product drawing. | Visual inspection per product drawing. Per EIA-364-18 |
| Final examination of product | Meets visual requirements. | Visual inspection per product drawing. Per EIA-364-18 |
| Low Level Contact Resistance | 25 m max. for 30 pin gold plated product. 30 m max. for 15 pin and gold flash plated product. | Per EIA 364-23. Subject mated contacts assembled in housing to 20 mV open circuit at 100 mA maximum. |
| Dielectric Withstanding Voltage | No creeping discharge or flashover shall occur. Leak current: 1mA Max. | Per EIA 364-20 Apply 1000V AC for 1 minute at sea level at adjacent contacts and between contacts and metal shell of unmated connector assemblies. |
| Insulation Resistance | 5000 M minimum initial. 1000 M minimum final. | Per EIA 364-21. 500V DC for 1 minute, test between adjacent contacts of unmated connector assemblies |
| Temperature Rise | 30C maximum temperature rise at specified current. | EIA 364-70 Measure temperature rise vs current. All positions series wired individually forming a single circuit in each connector. Rated current when all contacts are loaded |
| Vibration, Random | No discontinuities greater than 1 microsecond. | Per EIA 364-28, condition V, test letter F Duration 15 minutes. 15 minutes in each of three mutually per planes. |
| Physical Shock | No discontinuities greater than 1 microsecond. No physical damage. | Per EIA 364-27 Subject mated connectors to 50 G's half-sine shock pulses of 11 milliseconds duration. 3 shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. |
| Mating Force | 150N max. | Per EIA 364-13. Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Unmating Force | 150N max. | Per EIA 364-13. Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Durability | See note. | Per EIA 364-09 Mate and unmate connector assemblies for 100 cycles for gold flash and 15pin gold plating , 500 cycles for 30 pin gold plating at maximum rate of 200 cycles per hour. |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Per EIA 364-52 For wave soldering Temperature: 245C5C Immersion duration : 5 seconds After 1 hour 5 minutes steam aging |
| Thermal Shock | See note. | Per EIA 364-32, test condition VII Subject mated connectors to 5 cycles Between -55C and +105C with each cycle consisting of 30 minute dwells at -55 and 105C. The transition between temperatures was less than 5 minutes. |
| Humidity | See note. | Per EIA 364-31 Method II test condition A Subject mated connectors to 96 hours at 40C with 90% to 95% RH. |
| Temperature Life | See note. | Per EIA 364-17 test condition IV Method A Subject mated connectors to temperature life at 105C for 500 hours. |
| Salt Spray | See note. | Per EIA 364-26 Mated connector Salt concentration: 5%, 352 C, 8 hours |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales