Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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Since 2009
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TE Connectivity 205201-7

Price Negotiable
Price: Negotiable
MOQ: 40000
Delivery Time: 25-42 weeks
Brand: 205201-7
Product Description

This product information details various plating specifications and material requirements for connector components. It outlines specific plating thicknesses, materials, and application areas, including tin-lead, tin, nickel, and gold plating, along with their respective standards and tolerances. The information is intended for manufacturing and quality control purposes in the electronics industry.

Plating Type Tin-Lead, Tin, Nickel, Gold
Plating Thickness Various, e.g., 1.27m, 0.76m, 2.54m, 0.076m
Standards Mentioned MIL-T-10727, MIL-G-45204, MIL-STD-1247
Description Plating Material Thickness (m) Thickness (inch) Standard Notes
Main Tin or Tin-Lead Cover Tin-Lead 1.27 .000050 MIL-T-10727
Gold Flash Over Nickel Gold 0.27 .000010 MIL-G-45204 On mating end
Nickel Underplate Nickel 1.20 .000047 Under Gold Flash
Tin Plating Tin 2.54 .000100 MIL-T-10727
Nickel Plating Nickel 2.50 .000100
Gold Plating Gold 0.76 .000030 MIL-G-45204 For mating end
Tin Plated Wire Barrels Tin 0.75 .000030
Nickel Underplate Nickel 0.76 .000030 Under Tin
Nickel Underplate Nickel 0.76 .000030 Under Gold
Gold Plating Gold 2.54 .000100 MIL-G-45204 For mating end
Tin Plating Tin 2.54 .000100 MIL-T-10727 For mating end
Nickel Underplate Nickel 1.27 .000050 Under Tin

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Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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