XKB Connection U263-163N-4WS1735
Price:
Negotiable
MOQ:
5
Delivery Time:
1 working day
Brand:
U263-163N-4WS1735
Product Description
Product Description
This product features high-temperature resistant plastic housing (UL94 V-0), copper alloy contacts, and SUS304 mid-plates and front shells. It is designed for USB Type-C applications.
Housing Material
High Temperature Resistant Plastic, UL94 V-0
Contacts Material
Copper Alloy
Mid Plate Material
SUS304
Front Shell Material
SUS304
Part Number
U263-16XN-4XS1735
Model Type
TYPEC ANGULAR 5
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Contact Plating (Under Plated) | Ni 50u'MIN | Over all | |
| Contact Plating (Functional Area) | Au | Gold plating thickness follows Pt specifications of the solder area | |
| Front Shell Plating (Under Plated) | Ni 30u'MIN | Over all | |
| Insertion Force | 0.5~2.0 | kgf | |
| Removal Force | 0.8~2.0 | kgf | |
| Durability | 10000 | Cycles | |
| Current Rating | 0.8 | A | |
| Voltage Rating | 150 | V | |
| Insulation Resistance | 100 | M MIN | |
| Dielectric Withstand Voltage | AC 100 | V for 1 Minute | |
| Low Contact Resistance (Initial) | 40 | M | |
| Low Contact Resistance (After) | 50 | M | |
| Operating Temperature | -25 ~ +85 | C | |
| Reflow Peak Temperature | 260 | C | Maintained for 10 seconds on the board |
| Pin Number | Signal Name | Pin Number | Signal Name |
|---|---|---|---|
| A1 | GND | B1 | GND |
| A2 | VBUS | B2 | VBUS |
| A3 | D+1 | B3 | SBU1 |
| A4 | D-1 | B4 | CC1 |
| A5 | SBU1 | B5 | CC2 |
| A6 | VBUS | B6 | VBUS |
| A7 | D+2 | B7 | Dn2 |
| A8 | D-2 | B8 | Dp2 |
| A9 | GND | B9 | GND |
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Get in Touch
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales