SHOU HAN MICRO QTZB5.5
Price:
Negotiable
MOQ:
20
Delivery Time:
1 working day
Brand:
MICRO QTZB5.5
Product Description
Product Overview
This document outlines the specifications for the MICRO QTZB5.5, a product from SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details the material composition, electrical, mechanical, and environmental performance characteristics, along with testing methods and standards.
Product Attributes
- Brand: MICRO
- Origin: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
- Model: QTZB5.5
- Material Code: 1
- Certifications: UL94V-0 (for LCP plastic)
Technical Specifications
| Test Item | Specifications and Standards | Test Method and Reference Standard |
| Electrical Performance | Contact Resistance: 30m MAX | Test product contact impedance value with low-power current (0.5mA). Ref: EIA 364-23A |
| Insulation Resistance: 100M MIN | Test plastic impedance between adjacent contact pins. Ref: EIA 364-21A | |
| Withstand Voltage Test: 250V AC 1 minute | Test plastic withstand voltage between contact pins with 0.5mA current for 1 minute. Ref: EIA 364-20A | |
| Mechanical Performance | Insertion Force: 3.57kgf MIN | When matched with the wire end, the force when the wire end is inserted at a speed of 25mm/min. Ref: EIA 364-13A |
| Extraction Force: 1.00kgf MIN | When matched with the wire end, the force when the wire end is extracted at a speed of 25mm/min. Ref: EIA 364-13A | |
| Retention Force (Single PIN): 0.3 kgf MIN | The force at which the contact PIN retracts from the plastic at a speed of 25mm/min. | |
| Durability Test: 3000 cycles | Insert and extract the product at a uniform speed of 600 times per hour. Ref: EIA 364-09A | |
| Vibration Test | Amplitude: 1.5mm, Frequency: 10Hz to 55Hz (cycle), Duration: 2 hours in X/Y/Z directions each. Ref: EIA 364-28A | |
| Environmental Performance | Tin Adhesion: 95% or more tin coverage | Product welding area immersed in a tin bath at 2355 for 50.5 seconds. Ref: MIL STD-202F |
| High Temperature Resistance: No obvious discoloration or blistering; smooth solder wetting on solder feet. | Place the product in a 85 high-temperature oven for 96 hours, then observe after 3 hours at room temperature. Ref: MIL STD-1344A | |
| Low Temperature Resistance: No obvious discoloration or blistering; smooth solder wetting on solder feet. | Place the product in a -40 low-temperature oven for 96 hours, then observe after 3 hours at room temperature. Ref: MIL STD-1344A | |
| Moisture Resistance: No obvious corrosion. | Place the product in an environment with temperature 402 and humidity 9095RH for 120 hours, then observe. Ref: EIA 364-31A | |
| Corrosion Resistance: No obvious corrosion. | Place the product in a salt spray chamber with 5% salt water concentration and temperature 352 for continuous spraying for 24 hours, then observe after 1 hour at room temperature. Ref: EIA 364-26A | |
| Material Details | Plastic: LCP UL94V-0 | |
| Contact Terminal: C5191R-H, Nickel base, Gold plated contact area 1 | ||
| Housing: C2680R-H, Nickel plated housing base 50, Nickel plated 80 | ||
| Working Conditions | Working Current: 1.0 Ampere | |
| Operating Temperature: -30+80 |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales