Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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17 Years
Since 2009
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XUNPU TYC-325-CB08

Price Negotiable
Price: Negotiable
MOQ: 1000
Delivery Time: 12-17 working days
Brand: TYC-325-CB08
Product Description

Product Overview

This specification covers the performance, tests, and quality requirements for the XUNPU ELECTRONICS CO.,LTD USB 3.1 TYPE-C series connectors. Designed for general applications, these connectors provide reliable electrical and mechanical performance.

Product Attributes

  • Brand: XUNPU ELECTRONICS CO.,LTD
  • Origin: DONGGUAN XUNPU ELECTRONICS CO.,LTD
  • Product Type: USB 3.1 TYPE-C Connector
  • Model Series: USB 3.1 TYPE C

Technical Specifications

Specification Details
Product Model TYC-325-CB08
Voltage Rating 30V AC
Current Rating 3A
Operation Temperature Range -30 to +80
Test Temperature Range -15 to +35
Test Humidity Range 25% to 85%
Contact Resistance (Dry Circuit) 40m MAX
Dielectric Withstanding Voltage 100V AC (RMS) for 1 minute between adjacent terminals of ground (No Breakdown or flashover, Leakage current: 0.5mA Max)
Insulation Resistance (Unmated) 100M min (Applied 500V DC for 1 minute between adjacent terminals of ground)
Insertion Force 0.50kgf/MIN, 2.0kgf/MAX
Withdrawal Force 0.80kgf/MIN, 2.0kgf/MAX
Durability Cycles 10,000 cycles
Vibration (Amplitude) 1.52mm P-P or 147m/s {15G}
Vibration (Sweep Time) 50-2000-50Hz in 20 minutes
Vibration Contact Resistance Change 30m Max (DC 100mA current flowed during test)
Physical Shock (Acceleration) 490m/s (50G)
Physical Shock Pulse Width 11msec (Half-sine waveform)
Physical Shock Contact Resistance Change 40m Max (During test)
Thermal Shock Cycles 10 cycles of (-553 for 30 min) and (+853 for 30 min)
Thermal Shock Contact Resistance Change 40m Max (After test)
Solder Ability Dipped in solder bath 2605 for seconds; 95% solder coverage required on inspected area of each lead.
Humidity (Mated) Contact Resistance Change 30m Max (After 96 hours at +25 to +85, 90% to 95% RH)
Humidity (Unmated) Dielectric Withstanding Voltage Conform to requirements (After 96 hours at +25 to +85, 90% to 95% RH)
Humidity (Unmated) Insulation Resistance Conform to requirements (After 96 hours at +25 to +85, 90% to 95% RH)
Salt Spray Duration (Condition 1) 24 hours (Contact plated gold 15u, shell: copper alloy or stainless steel)
Salt Spray Duration (Condition 2) 12 hours (Contact plated gold
Salt Spray Result No detrimental corrosion (Terminal solder tail unrequested)
Cold Resistance Contact Resistance Change 30m Max (After 168 hours at -253)
Cold Resistance Shell Part Change 50m Max (After 168 hours at -253)
Heat Resistance Contact Resistance Change 30m Max (After 168 hours at 852, Mated connectors)
Heat Resistance Shell Part Change 50m Max (After 168 hours at 852, Mated connectors)
Thermal Aging Contact Resistance Change 40m Max (After 250 hours at +852, Unmated connectors)
IR-reflow Solder Temp 2605, 101sec
IR-reflow Result No physical damage shall occur.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sales

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