Liquid Cooling Plate

Clip-type Zipper Fin Computer CPU Heat Sink With 4 Heat Pipes Advanced cooling solution designed for high-performance computing systems with innovative zipper fin technology and four heat pipes for superior thermal management. Product Specifications Material: Aluminum + Copper Dimensions: 122×88×72mm Weight: 0.56 kg Heat Conducting Power: 120W Surface Treatment: Passivation Technology: Zipper fin + surface finish CPU Zipper Fin Heat Sink Technology Heat sinks are essential

Copper-Aluminum Composite Fin Computer CPU Heat SinkMaterial: Aluminum + CopperDimensions: 122×50×115mmWeight: 0.45 kgHeat Conducting Power: 60WSurface Treatment: PassivationProduct Technology: Zipper fin + Surface finish This advanced CPU heat sink utilizes innovative technology to deliver superior thermal cooling performance at lower costs. The copper-aluminum composite construction ensures efficient heat dissipation for high-performance computing applications. CPU Zipper

580W Aluminum Fin Heat Pipe CPU Heat SinkMaterial: AL 1100 + CU 1020Size: 26.8 × 2.8 × 10.5 cmTechnology: Zipper finSurface Treatment: Oil cleared, cleaned and passivationHeat Conducting Power: 580W This high-performance CPU heat sink features advanced zipper fin technology, delivering exceptional cooling capability and thermal conductivity for demanding computing applications. Skiving Fin Technology Skiving fin technology involves mechanically cutting aluminum teeth from a

Black Extruded Heat Sink for CNC Machining High-performance thermal management solution designed for CPU and server applications, featuring advanced skiving fin technology for superior heat dissipation. Material: AL 1100 Size: 12×9.3×12.3cm Weight: 0.718kg Technology: Fins stamping Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 65W Skiving Fin Heat Sink Technology Skiving fin technology involves precision machining of aluminum teeth into

Custom Copper Thick Fin Skived Heat Sink Material: Copper 1020 Product Dimension: 80x40x12mm Product Weight: 0.18 kg Surface Treatment: Passivation Heat Conducting Power: 50W Product Technology: Skiving + Passivation This custom copper thick fin skived heat sink delivers reliable performance and excellent thermal conductivity for demanding thermal management applications. Skived Fin Heat Sink Technology Skiving fin technology involves mechanically cutting aluminum or copper

Custom Copper Thick Fin Skived Heat Sink Material: Copper 1020 Product Dimension: 80x40x12mm Product Weight: 0.18 kg Surface Treatment: Passivation Heat Conducting Power: 50W Product Technology: Skiving + Passivation This custom copper thick fin skived heat sink delivers reliable performance with excellent thermal conductivity, specifically engineered for demanding thermal management applications. Skived Fin Heat Sink Technology Skiving fin technology involves mechanically

Liquid Cooling System Copper High-Density Fin Heat SinkMaterial: Copper 1020Product Dimension: 70×70×9mmProduct Weight: 0.089 kgSurface Treatment: PassivationHeat Conducting Power: 30WProduct Technology: Skiving + PassivationSkiving Fin Heat Sink TechnologySkiving fin technology involves precision machining of copper teeth to create specialized radiator profiles using advanced skiving fin machinery. The resulting skiving fin heat sink features a uniform gap structure formed

Amplifier Heat Sink Aluminium Extrusion Skived Heatsinks High-performance aluminium heat sinks designed for efficient thermal management in demanding electronic applications. Material: AL 1060 Size: 50×50×70mm Technology: Extruded + CNC Machined Surface Treatment: Passivation Heat Conducting Power: 40W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical

40W Extrusion Profile Aluminum Heat Sink Material: AL 6061 Aluminum Dimensions: 20 × 18 × 22 mm Manufacturing Technology: Extruded + CNC Machined Surface Treatment: Anodized Heat Conducting Power: 40W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical communication components for edge computing nodes Manufacturing Capabilities Advanced Brazing Technology

30W Light Street Aluminum Foil Extrusion Heat Sink Advanced cold forged heat sink designed for optimal thermal management in demanding applications. Material: AL 6061 Size: 8×8×5cm Weight: 0.187kg Surface Treatment: Black anodized Heat Conducting Power: 30W Key Features High cooling efficiency and energy-saving performance Cold forging process optimizes material microstructure High-purity aluminum (AL1050/AL1070) with excellent thermal conductivity Copper (C11000) options for

CPU Heatsink With Anodized Aluminum Extrusion Material: Al 6063 Dimensions: 7.6 × 7.6 × 15.5 cm Weight: 0.358 kg Heat Conducting Power: 60 W Surface Treatment: Anodized Key Feature: High precision and fast production efficiency Extruded heat sinks offer excellent thermal performance and energy efficiency. These aluminum profile heat sinks are widely used across multiple industries including 5G telecommunications, UPS systems, charging stations, electronic appliances, and

30W Cylindrical Aluminum Heat Sink for LED Lighting Fixtures High-performance cylindrical aluminum heat sink designed specifically for LED lighting applications, offering excellent thermal management and energy efficiency. Material: Al 6063 Dimensions: 9×9×5 cm Weight: 0.358 kg Heat Conducting Power: 30W Surface Treatment: Passivation Feature: High Efficiency & Energy-Saving Extruded heat sinks provide superior thermal performance with excellent energy efficiency. Commonly

60W Liquid Bending Copper Cooling Tube High-performance copper cooling tube designed for efficient thermal management in demanding applications. Material: CU1020 Size: 98×85×72mm Technology: Zipper Fin Heat Conducting Power: 60W Surface Treatment: Oil Cleared, Cleaned & Passivation Key Features: Excellent cooling capability with guaranteed leak-proof performance. Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for

Pure Copper Flat Straight Type Heat Conduction Tube High-performance heat conduction tube designed for efficient thermal management in demanding applications. Material: Copper Thickness: 0.2mm Diameter: Φ 6mm Surface Treatment: Passivation Heat Conducting Power: 25W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical communication components for edge

Aluminum Buckle Fin Stacked Active Composite Heat Sink Material: AL 1100 Size: 120×80×56mm Technology: Zipper fin + pipes pressing Feature: Good cooling capability and no leakage default Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 85W What is a Composite Heat Sink? A composite heat sink is a heat dissipation component formed through specific processes by combining two or more materials with different thermal and mechanical properties. This

Aluminum Buckle Fin Stacked Active CPU Heatsink Material: AL 1100 Dimensions: 158 × 120 × 68mm Manufacturing Technology: Zipper fin + pipes pressing Key Features: Excellent cooling capability with zero leakage default Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 55W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical

Aluminum Active Heatsink for Computer CPU High-performance cooling solution designed for demanding computing applications with superior thermal management capabilities. Material: AL 6061 Aluminum Dimensions: 120 × 95 × 96mm Manufacturing Technology: Zipper fin with pipes pressing Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 60W Key Features: Excellent cooling capability with zero leakage default Application Fields 100G/200G pluggable optical

220W Copper Buckle Fin Heat Sink For Projector Lamp Material: Copper Dimensions: 132×78×25mm Weight: 1.5 kg Heat Conducting Power: 220 W Surface Treatment: Passivation Product Technology: Zipper fin + surface finish This advanced heat sink features new technology and high-efficiency cooling capabilities specifically designed for projector lamp applications. Heat Sink Technology Overview Electrical and electronic components generate heat during operation when powered. High

Buckle Fin Copper Heat Sink Power Supply Cooling Plate High-performance cooling solution designed for power supply applications, featuring advanced buckle fin technology and copper construction for superior heat dissipation. Material: Aluminum + Copper Dimensions: 115×85×68mm Weight: 1.1 kg Heat Conducting Power: 152W Surface Treatment: Passivation Product Technology: Zipper fin + surface finish Server Heat Sink Specifications In server terminology, "U" refers to the

1500W LED Heat Sink - 5 Zipper Fin Heat Pipe Cooling Module Material: Aluminum + Copper Product Dimension: 248×290×68mm Product Weight: 2.8 kg Surface Treatment: Passivation Heat Conducting Power: 105W Product Technology: Zipper fin + surface finish Advanced Heat Dissipation Technology This high-performance LED heat sink utilizes aluminum fins to maximize heat dissipation surface area. The innovative design incorporates heat-conducting plastic components that enhance thermal