Liquid Cooling Plate

58W High Density Copper Pin Fins Skived Heatsink Material: Copper Size: 5×3×0.9 CM Technology: Skived fin Feature: Good cooling capability Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 58W Skived fin technology involves mechanically cutting aluminum or copper teeth from a solid profile to create specific radiator models. The finished skived fin heat sink features a gap structure with uniform sequencing, formed by cutting material at specific

400W Anodized Aluminum Profile LED Heat Sink Material: AL 1100 Size: 125*10*8CM Weight: 0.78 kg Technology: Zipper fin Feature: Good cooling capability and energy-saving Surface treatment: Anodized black Heat conducting power: 400W Skiving fin technology involves processing aluminum profiles into specialized radiator models using skiving fin machine tools. The resulting skiving fin heat sink features a gap structure formed by cutting material at specific angles through

600W LED Heat Sink Finned Heat Pipe Double Tower Radiator High-performance cooling solution designed for demanding industrial applications with superior heat dissipation capabilities. Product Specifications Material: AL 6061 Size: 128×18×16 CM Weight: 2.9 kg Technology: Skived Fin Heat Conducting Power: 600W Surface Treatment: Oil Cleared, Cleaned Key Features Excellent cooling capability for high-power devices Fast production efficiency with automated processes 8-15% higher

High-Density Stacked Al-Cu Fin Heat Pipe Server Heat Sink Advanced cooling solution designed for high-performance server applications with superior thermal conductivity and efficient heat dissipation. Product Specifications Material: AL 6061 Size: 108 × 78 × 25.5 mm Weight: 0.38 kg Technology: Fins stamping Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 85W Product Advantages Standard 1U form factor (4.445cm thickness) compliant with EIA

CPU Cooler Fan For Power Supply Our newly designed CPU heat sink with high-speed fan is engineered for diverse applications including transportation systems, computer servers, LED lighting, laser equipment, air conditioning, and any electrical products that generate significant heat. Product Specifications Material: Copper and aluminum Product Dimension: Customizable Product Weight: 1.4kg Surface Treatment: Oil cleaning and anti-oxidation Heat Conducting Power: 120 W Product

High Conductivity CPU Cold Plate Radiator Advanced cooling solution designed for high-performance computing applications with superior thermal management capabilities. Material: Aluminum + Copper Dimensions: 122×88×72mm Weight: 0.58 kg Heat Conducting Power: 120W Surface Treatment: Passivation Product Technology: Zipper fin + Surface finish CPU Zipper Fin Heat Sink Technology CPU zipper fin heat sinks are essential components in modern computing systems, preventing processor

70W Copper Passive Cooling CPU Radiator Material: Al 1100 Dimensions: 45 × 12 × 2.5 cm Technology: Zipper fin Surface Treatment: Oil cleared, cleaned and passivation Heat Conducting Power: 70W The standard 1U heat sink measures 4.445cm in thickness, conforming to EIA industry standards recognized worldwide. As the foundational generation of server heat sinks, this product category continues to expand its applications across the computerized industry. With the growing

80W Copper Heat Pipe Welding Joint Bending Heat Pipes High-performance copper heat pipes designed for efficient thermal management in demanding applications. Material: Copper Thickness: 0.25mm Diameter: Φ 12mm Heat Conducting Power: 80W Surface Treatment: Passivation Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical communication components for edge

Copper Liquid-Cooled Right-Angle Curved Heat Pipe High-performance copper heat pipe designed for efficient thermal management in demanding applications. Material: Copper Thickness: 0.25mm Diameter: Φ 8mm Surface Treatment: Passivation Heat Conducting Power: 50W Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules for fronthaul/mid-haul equipment of 5G base stations Low-power optical communication components for edge computing

Copper Tubular Heat Pipes with Connectors & Copper Cold Plates High-performance thermal management solutions designed for advanced electronic cooling applications. Material: Copper Thickness: 0.2mm Diameter: Φ 8mm Heat Conducting Power: 60W Surface Treatment: Passivation Key Features High efficiency heat conducting for optimal thermal performance in demanding applications. Application Fields 100G/200G pluggable optical modules for data center switches Small optical modules

Copper Curved Ultra-Thin Heat Pipe Accessories High-performance copper heat pipe accessories designed for liquid-cooled plates in advanced thermal management applications. Product Specifications Material: Copper Thickness: 0.3mm Diameter: Φ 5mm and Φ 6mm Surface Treatment: Passivation Heat Conducting Power: 30W Key Features High efficiency heat conducting for optimal thermal performance in demanding applications. Application Fields 100G/200G pluggable optical modules for data

Aluminum Alloy Liquid-Cooled Box for New Energy Vehicles This aluminum alloy liquid-cooled box (liquid-cooled chassis/shell) is engineered for efficient heat dissipation in demanding applications including new energy vehicle battery packs, energy storage systems, and high-power electronic equipment. Core Features Material: Aluminum alloy (6061/5052 series) providing lightweight construction with excellent thermal conductivity Structure: Welded/spliced box design with flange

Customized Cold Plates for Dehumidifier Applications Advanced liquid cooling cold plates specifically designed for dehumidifier systems, providing efficient thermal management solutions. Liquid cooling represents a highly effective thermal dissipation method widely utilized across industrial applications including high-power laser systems, microwave technology, automotive engine heat exchange, and advanced cooling systems. The superior specific heat capacity of liquid coolant

30W Tubular Heat Sink - Anodized Skived Heat Sink 45-75W Round Pin Fin Anodized Aluminum Cold Forged Heat Sink designed for optimal thermal performance in LED grow light applications. Key Features Easy installation with comprehensive tutorials for DIY LED grow light assembly Standard product range from 40W to 500W with professional thermal analysis, CAD design, and technical support Complete LED grow lighting accessories available in one-stop solution Special aluminum

30W Tubular Heat Sink - Anodized Skived Heat Sink High-performance tubular heat sink manufactured using advanced cold forging technology for superior thermal management solutions. Product Advantages Manufactured from T1/T2 pure copper using cold forging process, featuring thermal conductivity up to 390W/m·K. Key Benefits: Optimal balance among thermal performance, reliability, cost, weight and dimensions 40% reduction in thermal resistance compared to traditional processes No

8–15W Black Anodized Aluminum Cylindrical Pin Fin Cold Forged Heat Sink For IGBT High-performance cylindrical pin fin heat sink designed for IGBT applications, manufactured using advanced cold forging technology for superior thermal management. Product Advantages Manufactured from T1/T2 pure copper with cold forging process, featuring thermal conductivity up to 390W/m·K. Achieves optimal balance among thermal performance, reliability, cost, weight and dimensions. Thermal

Cold Forged Heat Sink and LED Lighting Heat Dissipation Assembly Manufactured from T1/T2 pure copper using cold forging process, featuring thermal conductivity up to 390W/m·K. Achieves optimal balance among thermal performance, reliability, cost, weight and dimensions. Product Advantages Compared with traditional processes, thermal resistance is reduced by 40%. Cold Forging Advantages No black scale remains at the root of the pillars after CNC machining. Hot Forging

100mm Silver Casing Radial Aluminum Cold Forged Heat Sink High-performance radial aluminum heat sink manufactured using advanced cold forging technology for superior thermal management in demanding applications. Product Advantages Manufactured from T1/T2 pure copper with cold forging process Thermal conductivity up to 390W/m·K Optimal balance among thermal performance, reliability, cost, weight and dimensions 40% reduction in thermal resistance compared to traditional

Mini Square Copper Cold Forged Pin Fin Heat Sink High-performance copper heat sink manufactured using advanced cold forging technology for superior thermal management solutions. Product Advantages Manufactured from T1/T2 pure copper using cold forging process, featuring thermal conductivity up to 390W/m·K. Achieves optimal balance among thermal performance, reliability, cost, weight and dimensions. Compared with traditional processes, thermal resistance is reduced by 40%.

Aluminum-Copper Cold Forged Pin Fin Heat Sink For IGBT High-performance aluminum-copper cold forged pin fin heat sink specifically designed for IGBT applications, offering superior thermal management solutions. Product Advantages Manufactured from T1/T2 pure copper using cold forging process with thermal conductivity up to 390W/m·K. Achieves optimal balance between thermal performance, reliability, cost, weight and dimensions. Thermal resistance reduced by 40% compared to