Liquid Cooling Plate

Mini Air-Cooled System Central Processing Unit (CPU) Heat Sink Our mini air-cooled CPU heat sink features advanced thermal management technology designed for optimal performance and reliability in demanding applications. Design Features & Technology The accordion-style fin radiator design maximizes surface area through precisely bent thin aluminum plates, while vortex radiator blades are strategically tilted to enhance air circulation and heat dissipation efficiency. Material

Alloy Aluminum Skived Fin Heat Sink For CPU Cooling Customizable aluminum heatsink made from high-quality 6063 alloy, featuring precise CNC machining and anodized surface treatment for applications in LED lighting, electronics, and power supply equipment. Offers a tolerance of ±1% and versatile processing services including extruding, cutting, and drilling. Material Aluminum 6063, 6061, etc. Accept Customization Size Accept Customization Color Black, Silver, Accept Customizat

Brass Quick-Connect Fittings for Cold Plate Cooling Systems High-performance brass quick-connect fittings and accessories designed specifically for cold plate cooling systems, offering reliable connections and efficient thermal management. Manufacturing Specifications Processing Capabilities CNC Turning, CNC Milling Available Materials Aluminum: 2000 series, 6000 series, 7075, 5052, etc. Stainless steel: SUS303, SUS304, SS316, SS316L, 17-4PH, etc. Titanium: Grade F1-F5 Brass:

CNC Machined Stainless Steel Quick-Connect Fittings Precision-engineered quick-connect fittings designed for liquid cooling systems, manufactured using advanced CNC machining processes for superior performance and reliability. Manufacturing Specifications Processing CNC Turning, CNC Milling Materials Aluminum: 2000 series, 6000 series, 7075, 5052, etc. Stainless Steel: SUS303, SUS304, SS316, SS316L, 17-4PH, etc. Titanium: Grade F1-F5 Brass: 260, C360, H59, H60, H62, H63, H65,

Liquid Cooling Manifold for New Energy Vehicles The manifold (also referred to as a liquid cooling manifold) serves as the central hub for fluid distribution and collection in liquid cooling systems. Through pressure-stabilized distribution and centralized collection, it ensures uniform cooling fluid distribution among multiple branch cooling units, maintaining consistent heat dissipation performance throughout the system. Product Features Welded branch ports for excellent

Compact And Thin Liquid-Cooled Plate Water Cooling Distro Plate Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers,

Liquid Cooling Block Heat Sink Electronic Water-Cooled Plate Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers,

Custom Pure Copper Heat Sink for CPU Water Cooler Cold Plate Liquid Cooling Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal

Custom CNC Machined Anodized Copper Cold Plates Heat dissipation plays a pivotal role in digital economy development. As the physical cornerstone of digital infrastructure and essential component in the computing power industry chain, thermal management technology supports various digital applications—from national data centers and AI computing clusters to personal computers, smartphones, and IoT devices—ensuring robust operation and sustained growth of the digital economy.

CNC Machined Copper Fin Heat Sink For Server Cold Plate Cooling Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal computers,

Cold Plate Cooling Technology for Laser Water-Cooling Systems Advanced thermal management solution featuring C1100 pure copper heat sinks for superior heat dissipation in demanding industrial applications. Critical Role in Digital Infrastructure Thermal management technology serves as the physical foundation of digital infrastructure, supporting everything from national data centers and AI computing clusters to personal devices and IoT systems, ensuring stable operation and

Water Cooling Plates for New Energy Vehicles Heat dissipation technology serves as the fundamental infrastructure supporting digital economy development. As the physical foundation of digital infrastructure and critical component in computing power industry chains, thermal management enables reliable operation across diverse applications—from national data centers and AI computing clusters to personal devices and IoT systems. Industrial Applications Semiconductor and Chip

Copper Liquid Cold Plate Heat Sinks for Central Processing Units (CPUs) Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal

High-temperature Copper Staggered Fin Radiator For Liquid Cooling Plate Heat dissipation plays a pivotal role in the development of the digital economy. As the physical cornerstone of digital infrastructure and an indispensable key link in the computing power industry chain, thermal management technology strongly underpins various digital scenarios—from national-level data centers, artificial intelligence computing clusters and supercomputing centers down to personal

Fully Liquid-Cooled Charging Stack System Advanced liquid cooling system with 6.5KW heat source power designed for ultra-fast charging terminals. System Design & Components Comprehensive system comprising liquid-cooled radiators, circulating pumps, make-up pumps, water tanks, sensors, fans, and control systems. Designed for bottom installation in liquid-cooled charging piles with full customization capabilities. Technical Specifications Applicable liquid-cooled gun current:

Fully Liquid-Cooled Charging Stack Liquid Cooling System With 4.5KW Heat Source Power System Overview Our fully liquid-cooled charging stack system features a comprehensive structural design composed of liquid-cooled radiators, circulating pumps, make-up pumps, water tanks, sensors, fans, and control systems. The system is engineered for installation at the bottom of liquid-cooled charging piles and can be customized according to specific customer requirements. Cooling System

Fully Liquid-Cooled Charging Stack System Advanced liquid cooling system with 2.4KW heat source power designed for ultra-fast charging applications. System Overview Comprehensive liquid cooling solution composed of radiators, circulating pumps, make-up pumps, water tanks, sensors, fans and control systems. Designed for installation at the bottom of liquid-cooled charging piles with full customization capabilities. Application: Liquid-cooled ultra-fast charging terminals

Liquid Cooling System for High-Current Charging Applications Advanced fully liquid-cooled charging stack system compatible with liquid-cooled guns rated from 400A to 600A, designed for ultra-fast charging terminals. System Architecture Comprehensive cooling solution comprising liquid-cooled radiators, circulating pumps, make-up pumps, water tanks, sensors, fans, and integrated control systems. Designed for bottom installation in liquid-cooled super-charging piles with full

Liquid Cooling System for Charging Connector Thermal Management Advanced liquid cooling system designed specifically for thermal management of charging guns in high-power charging applications. System Components & Structure Comprehensive system including liquid-cooled heat exchangers, circulating pumps, make-up pumps, water tanks, sensors, fans, and control systems Designed for installation on top of main charging pile cabinets Suitable for 600KW ultra-fast charging pile

800KW Fully Liquid-Cooled Charging Stack Liquid Cooling System High-performance liquid cooling system designed for 800KW ultra-fast charging stations, featuring advanced thermal management technology and robust construction. System Components Liquid-cooled heat exchangers Circulating pumps and make-up pumps Water tanks and sensors High-efficiency fans Advanced control systems Designed for installation on top of main charging cabinet, suitable for 600KW ultra-fast charging