Fiber Laser Cutting Machine

Scribing and cutting for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, Silicon, germanium and Gallium arsenic semiconductor materials. Technical Parameters: Modulated frequency: 20- 80 kHz Beam power: Adjustable, max 20W Scribing speed: Adjustable, max 200 mm/ s Min scribing line width: 0.05 mm Scribing area: 156mm × 156mm,125mm × 125mm, CNC worktable accuracy: 0.01 mm Power supply: 1-phase 220 VAC +/- 10%, 50 Hz (A voltage