Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding

Discover the advanced Wafer Bonding Equipment designed for room temperature and hydrophilic bonding of Si-SiC and Si-Si wafers ranging from 2 to 12 inches. This high-end system features ultra-high precision optical alignment, closed-loop temperature/pressure control, and supports various bonding processes for power semiconductor device fabrication.