Ceramic Substrate

Aluminum Nitride AlN Ceramic Substrate, High Thermal Conductivity 0.5mm AlN Ceramic,6inch ceramic substrates AlN Introduce The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance,chemical resistance, and the linear expansion coefficient is similar with Si. As a new generation of ceramic material

25x25x2mmt AlN Ceramic Substrate plates with High Thermal Conductivity 200w AlN Introduce The aluminum nitride (AlN) ceramic has high thermal conductivity (5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance,chemical resistance, and the linear expansion coefficient is similar with Si. As a new generation of ceramic material,AlN ceramic attracts more and more

8Y-ZrO2 Good quality Customized Zirconia ZrO2 Ceramic Rod 1.ZrO2 Ceramic Rod Technical Data PSZ Ceramic Properties PROPERTIES Unit Zirconia Ceramic Al2O3 (ZrO2 )Content wt% ≥ 94 Density G /CM3 6.00 Hardness (HRA) HRA ≥ 90 Flexural Strength MPa ≥ 800 Max. use Temperature ℃ 1000 Gas-tightness Pass Thermal shock Resistance Pass Coeff. of Thermal exp. ×10-6/℃ 10.0 Volume Resistivity Ω·cm 20℃ 1014 Dielectric Strength KV/mm , DC≥ 20 Acid Resistance mg/cm2 ≤ 2.0 Alkali Resistance mg

TGV(Through-Glass Via)technology High quality borosilicate glass quartz Technical introduction In the field of advanced packaging, Through-Glass Via (TGV) is widely considered by the semiconductor industry as a key technology for next-generation 3D integration, mainly due to its broad application spectrum. TGV can be applied in areas such as optical communications, RF front ends, optical systems, MEMS advanced packaging, consumer electronics, and medical devices. Both silicon

Alumina ceramic parts Customer customization High temperature resistance Product description Alumina ceramic are usually prepared by sintering process. First, the original powder of alumina ceramic, usually alumina powder, is prepared by powder metallurgy. The original powder is then sintered at high temperature and pressure through process steps such as molding, pressing and sintering, so that the powder particles are combined into dense ceramic materials. Alumina ceramic is

mirror polished SIC ceramic tube customized shape wear-resistance Al2O3 ceramic cylinder 1. SIC Cermaic has the advantages of super hardness, high wear-resisting,good corrosion resistance and electric insulation,resistant acid-base,high intensity,thermostable,high temperature tolerance,good insulation,high strength,precision process,high mechanical strength,good chemical stability. Good smoothness, mechanical seal good, polishing surface and so on. 2. Forming methods includes

Silicon Carbide Ceramic SIC Cylinder,SIC ceramic parts, customized polishing silicon carbide ceramic bearing ring 1. Introduction:Silicon Carbide(SIC) is an excellent corrosion and abrasion resistance material.It is suitable for strong acid and base circumstance .Today the silicon carbide iswidely used in abrasives, refractories, ceramics, and various high-performanceapplications. Silicon Carbide FeaturesHigh bending strength High corrosion and wear resistanceLow densityHigh

1.0mm Thickness Aluminum Al2O3 Ceramic Substrate wafer, High Thermal Conductivity Al2O3 Ceramic plate ,4inch ceramic substrates wafer Al2O3 IntroduceAlumina Ceramicis the most mature of the engineering ceramics, offering excellent electrical insulation properties together with high hardness and good wear resistance,but relatively low strength and fracture toughness.Alumina ceramic is generally white but may also be pink or ivory.The color is derived from either the sintering

Diameter 10mm SiC ceramic ball High temperature resistance High hardness material Product description SiC ceramic ball is a kind of high performance ceramic product, made of SiC material. It has excellent wear resistance, corrosion resistance and high temperature resistance, making it widely used in many fields. The high hardness of SiC ceramic balls enables them to withstand strong wear environments, such as in the mining, chemical and oil and gas industries. At the same

High performance SSIC SiC silicon carbide sic ceramic mechanical seal ring 1. Material: Silicon carbide ceramic Silicon carbide has been the most widely used material for the use of structural ceramics. Characteristics such as relatively low thermal expansion, high force-to-weight radius, high thermal conductivity, hardness, resistance to abrasion and corrosion, and most importantly, the maintenance of elastic resistance at temperatures up to 1650 ° C, have led to a wide

polished SIC ceramic customized shape wear-resistance Al2O3 ceramic parts mirror polished SIC ceramic tube customized shape wear-resistance Al2O3 ceramic cylinder 1.Introduction of Silicon Carbide: Silicon carbide (SiC), also known as carborundum, is a compound ofsilicon and carbon with a chemical formula SiC. It occurs in nature as the extremely rare mineral moissanite. Silicon carbide powder has been mass-produced since 1893 for use as an abrasive. Grains of silicon carbide

polished SIC ceramic customized shape wear-resistance Al2O3 ceramic parts mirror polished SIC ceramic tube customized shape wear-resistance Al2O3 ceramic cylinder 1. SIC Cermaic has the advantages of super hardness, high wear-resisting,good corrosion resistance and electric insulation,resistant acid-base,high intensity,thermostable,high temperature tolerance,good insulation,high strength,precision process,high mechanical strength,good chemical stability. Good smoothness,

Silicon Carbide Ceramic Substrate,SIC ceramic parts, customized polishing silicon carbide ceramic bearing ring 1. Introduction: 1. SIC Cermaic has the advantages of super hardness, high wear-resisting, good corrosion resistance and electric insulation,resistant acid-base,high intensity,thermostable,high temperature tolerance,good insulation,high strength,precision process,high mechanical strength,good chemical stability. Good smoothness, mechanical seal good, polishing

6inch 1.0mm polished Aluminum Al2O3 Ceramic Substrate, High Thermal Conductivity, Customized Al2O3 Ceramic,6inch ceramic substrates A2O3 Introduce Al2O3 substrate is the most popular ceramic substrate, with excellent heat resistance, high mechnical strength , abrasion resistance and small dielectric loss . The surface of alumina substrate is quite smooth and low porosity , 99.6% alumina substrate is suitable for thin film device , 96% alumina substrate is suitable for thick

6inch 1.0mmAluminum Nitride AlN Ceramic Substrate, High Thermal Conductivity, Customized AlN Ceramic,6inch ceramic substrates AlN Introduce The aluminum nitride (AlN) ceramic has high thermal conductivity(5-10 times as the alumina ceramic), low dielectric constant and dissipation factor, good insulation and excellent mechanical properties, non-toxic, high thermal resistance, chemical resistance ,and the linear expansion coefficient is similar with Si,which is widely used in

Device-Grade hBN Single Crystal for 2D Materials, Graphene Electronics and Deep-UV Applications Device-Grade Hexagonal Boron Nitride (hBN) Single Crystal is a high-purity bulk crystal material grown using a proprietary atmospheric-pressure growth process. Designed specifically for advanced research and next-generation electronic and photonic devices, these crystals provide an ultra-clean, atomically flat platform for graphene heterostructures, van der Waals devices,

Alumina Ceramic Heat Sink Plate 310×310mm Al₂O₃ Thermal Management Substrate The 310 × 310 mm Alumina Ceramic Heat Sink Plate is a large-format thermal management substrate manufactured from high-purity Al₂O₃ ceramic material. Designed for high-power and high-reliability environments, it combines efficient heat dissipation, excellent electrical insulation, and long-term thermal stability in a single engineered component. Compared with conventional metal heat sinks, alumina

Ultra-Thin Free-Standing Diamond Flexible Film is an advanced thermal management material engineered for next-generation semiconductor packaging and high-power electronic applications. Manufactured using proprietary MPCVD diamond growth technology, the film features a self-supporting structure with thicknesses ranging from 5 μm to 25 μm, eliminating the need for rigid carrier substrates or adhesive backing. Combining the exceptional thermal conductivity of diamond with

Ultra-Thin Silicon-Based Diamond Film is an advanced thermal management material fabricated by directly growing polycrystalline diamond on silicon substrates using Microwave Plasma Chemical Vapor Deposition (MPCVD) technology. With a diamond layer thickness below 1 μm and exceptional thermal conductivity, this material provides an effective near-junction heat spreading solution for next-generation semiconductor devices. Unlike conventional thermal interface materials, the

Custom Silicon Carbide (SiC) Stepped Ceramic Plate for Semiconductor Equipment Product Overview This custom silicon carbide ceramic component features a circular plate geometry with a precision-machined stepped edge. The stepped structure enables accurate axial positioning and stable integration into semiconductor process chambers and advanced thermal systems. Manufactured from high-purity SiC ceramic, the component offers excellent resistance to high temperatures, plasma