Electronics X Ray Machine

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Packing Weight 2600 kg Power Consumption 3.5 kW X-Ray Tube Tube Type Type Sealed type Max.

Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive FEATURES of Desktop X-ray machine 1. 5μm 100kV X-ray tube; 2. Dynamic FPD with a high resolution of 1000×1124; 3. Equipped with 360° rotary fixture to eliminate PoP shadow; 4. The detection area is easily positioned by an external rocker; 5. Inspection & Analysis of soldering joint and materials inner structure; 6. High safety with seamless lead welding, interlock, and emergency button.

Brand New Generation of CX3000 with Reel to Reel Function Making It More Competitive Specification Of Desktop X-Ray machine Item Definition Specs System Parameters Size 750(L)x570(W)x890(H)mm Weight 300kg Power 220AC/50Hz Power Consumption 0.5kW X-ray Tube Type Closed Max.Voltage 100kV Max.Power 200μA Spot Size 5μm Detector Intensifier FPD X-ray Coverage 48mm x 54mm Resolution 208Lp/cm Work Station Max.Loading Size 200mm x 200mm Max.Inspection Area 200mm x 200mm Oblique Angle

X-Ray Inspection Equipment for PCBA Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 130*130mm Frame Rates 20fps

X-Ray Inspection Equipment for Switch Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1220(D)×1615(H)mm Machine Weight 1250 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1250 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 129*129mm Frame Rates

X-Ray Inspection Equipment for Cable Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1220(D)×1615(H)mm Machine Weight 1250 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1250 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 85μm Effective Detection Area 129*129mm Frame Rates 30fps

X-Ray Inspection for Electronics Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1704(H)mm Machine Weight 1450 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 1750(W)×1920(D)×2000(H)cm Packing Weight 1620 kg Power Consumption 1.5 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector (FPD) Pixel Size 84μm Effective Detection Area 129*129mm Frame Rates 30fps

Unicomp AX8200Max microfocus X-ray Inspection System for Semiconductor BGA IC Cable & wires qualtiy inspection Specification Of SMT X Ray machine System Summary Footprint 1280(W)×1500(D)×1705(H)mm Machine Weight 1400 kg Power Supply AC 110~220V, 50/60Hz Plywood Packing Size 175(W)×155(D)×200(H)cm Packing Weight 1500 kg Power Consumption 1.0 kW X-Ray Tube Tube Type Sealed Max. Power 8W Voltage 0~90kV (Adjustable) Focus Spot Size 5μm Imaging System Detector Flat Panel Detector

Wire Harness Welding Quality Inspection by 2.5D micro focus X Ray Machine AX8200MAX Application Fields of BGA Xray machine AX8200max Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables,Aerospace Components, Photovoltaic Industry, etc. Function & Features of BGA Xray machine AX8200max 1. Large Size Inspection Table Laser Locator for Precise Location 2. 24’’ FHD Interactive

Unicomp 5μm close tube AX9100 X-ray machine with FPD oblique view for IC Semicon inspection Technical Data Item Definition Specs System Parameters Size 1350(L)x1250(W)x1700(H)mm Weight 1900kg Power 220AC/50Hz Power Consumption 1.6kW X-ray Tube Type Closed Max.Voltage 130kV Max.Power 40W Spot Size 7μm X-ray System Intensifier FPD Monitor 22 ‘’LCD System Magnification 1600 X Detection Region Max.Loading Size Φ570mm Max.Inspection Area 450mm x 450mm X-ray Leakage

110KV Industrial X-ray Inspection Machine for IGBT Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive

160KV Microfocus X-ray Inspection Machine for Semiconductor Wire Bonding NDT AX9600 Unicomp The UNICOMP AX9600 160KV microfocus X-ray inspection system is equipped with a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. Supporting a maximum geometric magnification of 2000× with superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy

Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Features 1. Professional semiconductor inspection configuration with 5μm ultra-high resolution 2. Extended detection scope,

Tilt BGA Solder Joint Electronics X-ray Inspection Machine AX8300MAX Advanced X-ray inspection system with Unicomp Auto Void Analysis for comprehensive semiconductor and electronics testing. Applications This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive parts, new energy industry components, aluminum die castings, injection molded plastics, ceramic products and other special industrial components. Key Features Professional

AX8300H X-ray inspection with 110kV microfocus source & 360° rotation. High-resolution FPD detection for BGA, CSP, semiconductor analysis. Meets FDA safety standards with

Unicomp AX9180: 180kV microfocus X-ray with 10μm spot size, 60° tilt, and 7-axis linkage. High-resolution FPD delivers 1000X magnification for precise PCB, BGA, and semiconductor inspection. Includes 1-year warranty and offline programming.

High Resolution Semiconductor X-Ray Inspection Machine AX8300 AX8300 adopts self-developed 110kV high-power micro-focus X-ray source with ultra-fine 2μm resolution. It supports 60° tilting & 360° rotating 2.5D omni-directional non-blind inspection, clearly identifying tiny internal defects of chips and solder joints. Our Service Commitment Response to inquiries within 12 hours Direct manufacturer pricing with competitive rates Comprehensive one-year warranty with free