SMT Reflow Oven

High vacuum furnace SMT Reflow Oven , Consumption solder reflow oven for PCB Mode 800M 800L 800CL 1000L 1200L Dimensions(L*W*H)mm 4800*1100*156 5000*1300*1560 5310*1560*1560 5700*1300*1560 6500*1300*1560 Color Weight 1600KG 2000KG 2400KG 2400KG 2800KG preheating zones Up 8bottom8 Up 10bottom10 Up 12bottom12 preheating length 2800mm 3140mm 3140mm 3880mm 4580mm Cooling zones 1 dedicated cooling + 1 external cooling 2 dedicated cooling + 1 external cooling 1 dedicated cooling +

product details LED Strip Reflow Oven A6 No.1 The unique advanced long life heating system 1.The heating system adopt the Swedish nickel heater with efficiency and energy-saving. The peak wave length of the radiation power is 4UM with curved surface reflector increasing temperature ramp up speed, improve the thermal efficiency. The special forced-air circulation system make PCB and the component heated uniform and eliminate the "shadow effect" completely. 2. Using special

product details SMD PCB Process LED Light Making Machine SMD Reflow Oven Machine for PCBA Application The 800XL SMT reflow soldering machine is a main equipment produced by Shengdian. It can be widely used for SMD soldering and fixing in SMT workshop for PCB board assembly, LED packaging, LED screen display, mobile phone motherboard, computer motherboard, safety control motherboard, electronic products etc. It can realize precise and stable temperature control in order to

product details SMT Assembly line lead free reflow oven for solar street light M600 Model M600 Heating System Number of heating zones Top 6/Bottom 6 Heating passage 2500MM Heating style hot air Cooling style Force air Conveyor System Max. Width of PCB 350mm Mesh belt width 400mm Conveyor Direction L-R(or R-L) Process Height 880±20mm Conveyor type Mesh and chain Range of rail width 0-300mm Conveyor speed 0-1500mm/min Auto/manual Lubrication standard Hood opening Manual(option:

product details SMT Assembly line Machine PCB soldering Reflow Oven for Consumer Electronics PCB production 800L No Scope of application 1 Suitable for solder paste type Lead-free solder, ordinary solder, red glue 2 Processing the maximum substrate size (MM) MAX 500(mm) 3 Applicable component type 0805, 0603, 0402. 0201, 01005 small components CSP, BGA, etc. single-sided / double-panel specification 1 Dimensions L*W*H(MM) 5000*1300*1520mm 2 Body weight 1800KG 3 Temperature

SMT reflow oven machine for welding chip/IC Capacitance resistance Annie Li ShenZhen Shengdian Electronic Equipment Co .,Ltd. Tel:+86-755-29878225 Email:annieli(at)shengdian.ecer.com Mob & Wechat & Whatsapp: +86-18666207435 Skype:+86-18666207435 Web: http://smt-equip.com/ http://www.shengdian.ecer.com/ Add.: Building A, No.98, Guangshen road, Dongfang community, Songgang residential district, Baoan district, Shenzhen, China