IC Package Substrate
Precision 0.15mm IC Package Substrate 4 Layer BT FR4 Flame Retardant
High precision IC substrate with 0.15mm thickness, 4 layer build, and flame retardant BT FR4 material. Supports fine line/space down to 25um, immersion gold finish, and custom options. Ideal for memory cards, semiconductors, and IC packaging. OEM/ODM available.
BOC Package Substrate for Memory Chip High Speed High Density 1mil Line Space 0.1-0.4mm Thickness
High speed high density BOC package substrate with soft gold finish for memory chips. Supports fine pattern MSAP technology, 1mil line space, and 0.1-0.4mm thickness. Customizable surface finish and layer count. Stable quality with 99.7% yield.
Soft Gold MCP CSP Package Substrate BT FR4 0.1-0.4mm Finished Thickness 1-6 Layer
High-reliability MCP/CSP package substrate for IC packaging. Supports 1-6 layers, 0.1-0.4mm finished thickness, and 1mil line/space. Features immersion gold finish, custom options, and stable quality with 99.7% yield. Ideal for smartphones, tablets, and IoT devices.
Precision 0.15mm IC Packaging Substrate 4 Layer Flame Retardant BT-FR4
High-precision IC substrate with 1mil line/space, 0.29mm finished thickness, and 4-layer build. Supports immersion gold finish and custom options. Ideal for memory cards, semiconductors, and IC packaging. ISO certified, OEM/ODM available.
Customizable Coreless IC Package Substrate 0.09mm Thickness 4 Layer BT Material
High-precision IC substrate with 0.09mm coreless thickness, 25um line space/width, and 4-layer build-up. Supports immersion gold finish and custom stack-ups. Ideal for DRAM, memory cards, and semiconductor packaging. ISO-certified manufacturer with 600,000 SQM annual capacity.
BOC Package Substrate High Speed High Density 1mil Line Space for Memory Chip
High-speed, high-density BOC package substrate with 1mil line space/width and 0.1-0.4mm finished thickness. Supports wire-bonding through central slot for memory chips. Features immersion gold finish, customizable layers, and 99.7% yield quality. Ideal for IC packaging, servers, and SSDs.
Soft Gold MCP CSP Package Substrate BT FR4 0.1-0.4mm Finished Thickness
High-precision IC substrate for MCP/CSP packaging. Supports 1-6 layers, 1mil line/space, and 0.1-0.4mm finished thickness. Features immersion gold finish, custom options, and stable quality with 99.7% yield. Ideal for semiconductors, smartphones, and IoT devices.