IC Package Substrate
eMMC IC Package Substrate PCB - 0.2mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
High-precision eMMC IC package substrate PCB featuring 0.2mm finished thickness and 1mil line width. Gold-plated BGA technology with FR4 material, customizable layers (1-6), and multiple surface finish options. Ideal for semiconductor packaging, wearable electronics, and consumer devices with 99.7% quality yield guarantee.
4-Layer BT Material IC Substrate - 25μm Line Width, 0.22mm Thickness for Semiconductor Packaging
Advanced 4-layer BT material IC substrate with 25μm minimum line width and 0.22mm finished thickness. Supports uMCP, MCP, UFS, CMOS, MEMS applications with customizable surface finishes and layer configurations. Manufactured by HOREXS with 600,000 SQM annual capacity and technical support for high-volume requirements.
0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness
Precision 0.2mm 2-layer memory card substrate with 25μm minimum line width and 0.29mm finished thickness. Supports Micro SD, TF cards, USB devices, and IC assembly with customizable 4-layer options. Manufactured by HOREXS with advanced capabilities including wire bonding, flipchip CSP, and buildup technologies. Ideal for semiconductor packaging and wearable electronics applications.
Hitachi BT IC Package Substrate 0.29mm Thickness 25μm Line Width for Memory Electronics Manufacturing
Professional IC package substrate manufacturing with 0.29mm thickness and 25μm minimum line width. Supports DRAM, SD cards, flash memory, and semiconductor packaging. Annual capacity of 600,000 SQM with advanced Tenting & SAP processes. Customizable materials, surface finishes, and layer configurations for diverse electronic applications.
0.15mm Thickness 2-Layer IC Package Substrate for Memory Cards with 0.32mm Finished Thickness and 25μm Line Width
High-performance IC package substrate designed for memory card applications including Micro SD, TF, and UDP cards. Features 0.15mm thickness, 0.32mm finished thickness, and 25μm minimum line width. Supports wire bonding, embedded memory, and advanced packaging technologies with customizable materials and surface finishes from leading manufacturers.
FBGA/PBGA/LGA IC Substrate Manufacturing - 25μm Line Width, 0.29mm Thickness, 4-Layer Customizable
Professional IC substrate manufacturing for semiconductor packaging with 25μm minimum line width, 0.29mm finished thickness, and 4-layer customizable design. Supports wire bonding, embedded memory, and flipchip CSP technologies. Annual capacity of 600,000 square meters with global shipping support. Ideal for smartphones, automotive electronics, and advanced computing applications.
25μm Line/Space FBGA Package Substrate for Memory IC - 0.22mm Thickness, 4-Layer Customizable Design
Professional 25μm line/space FBGA package substrate designed for memory IC applications including DDR SDRAM, NAND/Flash, and uMCP modules. Features 0.22mm finished thickness, customizable 4-layer construction, and multiple material options. Ideal for smartphones, servers, automotive electronics, and portable devices with advanced manufacturing capabilities supporting 10/10μm technology.
Hitachi BT Material IC Substrate 0.29mm Thickness with 25μm Line Width for Memory Electronics Manufacturing
Professional Hitachi BT material IC substrate manufacturing with 0.29mm thickness and 25μm minimum line width. Supports DRAM memory, SD cards, semiconductor packaging, and wearable electronics. HOREXS facility offers 600,000 SQM annual capacity with advanced Tenting & SAP processes. Customizable layers, surface finishes, and comprehensive technical support for high-volume applications.
0.15mm IC Assembly Package Substrate for Semiconductor Packaging - 1mil Line Width, 0.29mm Thickness
High-performance IC assembly package substrate with 0.15mm thickness and 1mil line width precision. Supports memory cards, DRAM electronics, and semiconductor packaging applications. Features customizable 4-layer construction, immersion gold finish, and compatibility with leading material brands. HOREXS manufacturing provides 600,000 SQM annual capacity with advanced Tenting & SAP processes.
AUS308 PSR IC Package Substrate - 1mil Line Width, 0.22mm Thickness for Memory Cards & Semiconductor Packaging
High-performance IC package substrate supporting UDP/TF/SD memory cards and semiconductor assemblies. Features 1mil line width precision, 0.22mm thickness, and customizable 4-layer construction. Manufactured by HOREXS with 600,000 SQM annual capacity, advanced Tenting & SAP processes, and comprehensive technical support for cost-effective solutions.
Storage IC Package Substrate PCB - 0.1-0.4mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
High-precision storage IC package substrate PCBs featuring 0.1-0.4mm FR4 thickness, 1mil line spacing, and gold plating. Ideal for BGA, UFS, eMMC, and MEMS applications in consumer electronics, wearables, and industrial devices. Manufactured with 99.7% quality yield using Japanese precision equipment.
25um BT IC Package Substrate Soft Gold Plating 4 Layer 0.22mm
High-precision IC substrate with 25um line/space, 0.22mm thickness, and soft gold plating. Supports custom surface finishes and materials. Ideal for semiconductor packaging, memory, and RF modules. ISO-certified, 600,000 SQM/year capacity. Request samples with Gerber files.
BT Memory Card BGA Substrate 6 Layer Immersion Gold IC Package Substrate 0.22mm
6-layer BT BGA substrate for memory card IC packaging. Features 1mil line/space, 0.22mm thickness, and immersion gold finish. Supports custom surface finishes and stack-ups. Manufactured by HOREXS, a leading Chinese IC substrate maker with 600,000 SQM annual capacity.
Fine Line IC Package Substrate 25um L/S 4 Layer for Wearable and Automotive Electronics
High-density IC substrate with 25um line/space, 4-layer build, and 0.22mm thickness. Supports immersion gold finish and custom options. Ideal for wearable, automotive, and memory packages. HOREXS ensures cost savings with certified quality.
0.26mm BT BGA IC Substrate Board 4 Layer Immersion Gold Semiconductor Package
High-precision IC substrate with 1mil line space/width and 0.26mm finished thickness. Supports 4-layer build-up, immersion gold finish, and custom options. Ideal for semiconductor packaging, memory, and wearable electronics. Certified manufacturer with 600,000 SQM annual capacity.
CSP BGA Semiconductor Packaging Substrate 4 Layer BT ENEPIG Surface Finish 0.22mm Thickness
High-reliability 4-layer BT substrate for IC packaging. Features 1mil line/space, ENEPIG surface finish, and 0.22mm thickness. Supports custom layers, soldermask, and copper weight. Ideal for BGA, CSP, and memory packages. HOREXS offers ISO-grade quality with fast global shipping.
NAND Flash Memory IC Packaging Substrate 4 Layer 0.22mm Thickness
High-density IC substrate for NAND/Flash memory packages. Features 1mil line/space, 0.22mm thickness, and 4-layer build. Supports custom surface finishes and materials. Ideal for smartphones, laptops, and wearables. HOREXS ensures cost savings with high quality.
Semiconductor IC Package Substrate 12um Copper Buildup 4 Layer 0.22mm
High-density IC substrate for semiconductor packaging. Features 12um copper buildup, 25um L/S, and 0.22mm thickness. Supports wire bonding, BGA, and flip-chip. Customizable surface finish and soldermask. ISO certified, 600K SQM annual capacity. Request quote with Gerber files.
IC Package Substrate 4 Layer BT Material 25um Line Space DRAM Memory Substrate
High-density 4-layer IC substrate with 25um line/space for DRAM and memory packages. BT material ensures thermal stability. Supports custom surface finish and stack-up. Ideal for smartphones, laptops, and portable devices. HOREXS quality.
ENEPIG Plating IC Package Substrate 4 Layer 0.22mm Thickness for Semiconductor Packaging
High-density IC substrate with ENEPIG surface finish, 1mil line space/width, and 0.22mm thickness. Supports custom layers, soldermask, and copper weight. Ideal for memory, MEMS, and RF modules. ISO certified, 600,000 SQM annual capacity.