Custom JEDEC Trays

Standard JEDEC trays designed for safe handling and transport of BGA, FBGA, QFP, and other IC packages. High temperature resistance, 100% customizable dimensions, and compatible with automated feeding systems. ISO 9001, ROHS, SGS certified. MOQ 500 pcs.

Durable JEDEC matrix tray for IC components, offering high temperature resistance up to 180°C. Made from MPPO with ROHS certification. Supports OEM/ODM custom sizes and colors. Ideal for automated pick-and-place in electronics, solar, and medical industries.

ESD-safe JEDEC matrix trays for BGA, QFP, QFN, TSOP. 322.6x136mm outline, stackable design. Surface resistance 10e4-10e11Ω. Custom cavities, colors, and OEM/ODM available. ROHS certified.

Hiner-Pack JEDEC IC trays offer antistatic protection, high-temperature resistance up to 150°C, and superior dimensional stability. Custom OEM/ODM options available. Compliant with ROHS and JEDEC standards for reliable shipping, baking, and storage.

Durable PPE JEDEC standard matrix tray for safe IC handling, transport, and storage. Features anti-static protection, precise 72-cavity layout, and flatness under 0.76mm. RoHS certified, supports OEM/ODM customization, and compatible with automated processes.

Custom JEDEC trays made from PEI material, offering UV resistance, anti-static protection, and stackable design. Ideal for secure transport and storage of electronic components. Withstand up to 150°C. ISO 9001, ROHS, SGS certified. Custom sizes and logos available.

High-performance MPPO trays with precision-molded pockets for secure IC handling. ESD protection, automation-ready design, and stable stacking. RoHS certified. Custom cavity sizes and pocket configurations available for OEM/ODM needs.

JEDEC-compliant custom tray with surface resistance 1.0x10e4-1.0x10e11Ω. Precision pockets ensure secure IC alignment. Stackable design with anti-static protection for automated handlers. RoHS certified. Accept OEM/ODM customization.

Durable ABS/PC JEDEC tray cover with anti-static protection and stackable design. Custom sizes available. Ideal for clean room IC packaging and transport.

Custom CNC-machined polycarbonate tray with 21 cavities in 3×7 matrix for precise electronic component protection. Features 1.0×10⁴-1.0×10¹¹Ω ESD resistance, ROHS SGS certification, and maximum 0.76mm flatness. Ideal for semiconductor, embedded systems, and power supply applications with full OEM/ODM support.

Standardized JEDEC trays for automated handling of IC components. Features ESD protection, high flatness (max 0.76mm), and customizable cavity dimensions. Available in multiple colors and materials (PPE, ABS, PEI). RoHS certified. Accept OEM/ODM orders.

JEDEC matrix trays with 12 cavities (2x6) for automated IC assembly and testing. Made of conductive PPE, flatness max 0.76mm, ROHS certified. Stackable design supports OEM/ODM customization for efficient storage and transport.

Custom JEDEC trays with precision machining and chemical resistance. Standard 322.6x136mm size, 0.25-inch low profile for BGA, QFP, QFN, TSOP. High profile 0.40-inch for PLCC, PGA. Stackable, antistatic, ROHS certified. Accept OEM/ODM.

RoHS compliant JEDEC trays for BGA, QFP, QFN, TSOP, and SOIC. Standard 322.6x135.9mm outline with 66 cavities. Low profile 6.35mm or high profile 10.16mm options. Stackable design with vacuum pick-up compatibility. Accept OEM/ODM customization.

Precision JEDEC matrix tray with warpage less than 0.76mm for reliable IC handling. Features 24 cavities, PEI material, and 80-180°C temperature resistance. Automation-ready with asymmetric end tabs and vacuum pickup points. Accepts OEM/ODM customization.

Durable, reusable JEDEC tray for CQFP48 chips. Meets RoHS and environmental standards. Customizable size, color, and material (ABS/PC/MPPO). Compatible with pick-and-place machines. Ideal for semiconductor handling, testing, and storage. OEM/ODM accepted.

Compliant with JEDEC standards, this black high-temperature IC tray offers 84 cavities (15x15x4.32mm each) for secure BGA packaging. Made from durable MPPO with RoHS certification, it supports OEM/ODM customization for reliable handling, testing, and transport.

Hiner-pack custom JEDEC trays ensure safe handling of BGA ICs with flatness ≤0.76mm and resistance 1.0x10e4-1.0x10e11Ω. ISO 9001, ROHS, SGS certified. Accept OEM/ODM. Durable, high-temperature resistant design for reliable semiconductor transport.

Custom JEDEC trays for secure BGA, FBGA, QFN, and QFP component storage. Stackable design with ventilation for safe transport. Flatness max 0.76mm, resistance 1.0x10e4-1.0x10e11Ω. Accept OEM/ODM. Durable, efficient, and tailored to your chip package needs.

Standard JEDEC trays with customizable cavities for BGA, QFP, and more. Stackable design with ventilation ensures safe transport. Durable construction, 100% custom options, and fast turnaround for automated or manual assembly.