IC Chip Tray

Professional black ESD anti-static IC chip tray with 1.0x10e4-1.0x10e11Ω surface resistance and 0.2mm flatness. Features high temperature resistance, corrosion protection, and compatibility with 2", 3", 4" feeder machines. Ideal for sapphire components, wafer die packaging, and optical device protection with OEM/ODM customization options.

Professional 2-inch square IC chip tray with 168 cavities for secure storage and transportation of integrated circuits. Features ESD protection (10⁴-10¹¹ Ω), 0.2mm flatness, ROHS certification, and custom OEM/ODM manufacturing capabilities. Ideal for wafer die, PCBA components, and electronic packaging applications.

Professional IC chip tray with 23.6x20.9mm pocket size featuring high temperature resistance, anti-static protection, and compatibility with 2", 3", or 4" Waffle Pack Feeder Machines. Customizable design options with CE and FDA certifications for secure electronic component storage and handling.

Professional customized VCM IC chip tray designed for small particle chips with 5mm thickness and anti-static properties (10⁴-10¹¹ ohms). Features high-temperature resistant PC material, waterproof design, and compliance with ISO, RoHS, and JEDEC standards. Ideal for semiconductor wafer die storage and electronic component protection with quick 7-25 day delivery.

Custom 2-inch waffle pack IC chip trays with 80 PCS capacity and 0.2mm flatness. Features high temperature resistance (120℃-220℃), anti-static protection (1.0×10⁴-1.0×10¹¹Ω), and compatibility with automation equipment. RoHS certified with OEM/ODM services available for semiconductor and electronic component handling.

Professional custom IC chip tray with 400PCS capacity, 50.7x50.7mm outline size, and ABS construction. Features ESD protection, high temperature resistance, and compatibility with standard feeder machines. ROHS certified with OEM/ODM services available for electronic component protection.

Professional PC Black Plastic IC Tray with superior anti-static protection, high temperature resistance up to industrial standards, and corrosion resistance. Compatible with 2", 3", or 4" Waffle Pack Feeder Machines. Features matrix arrangement design for maximum capacity and edge chamfer for error-free stacking. Certified to JEDEC standards for electronic component packaging in semiconductor, aerospace, and military applications.

Professional ESD black waffle pack IC chip tray with 50.7×50.7×4mm dimensions and 440 cavity matrix. Features anti-static protection (1.0×10⁴-1.0×10¹¹Ω), max 0.2mm flatness, and ROHS/SGS certification. Ideal for semiconductor, SMT, and electronic component manufacturing with custom OEM/ODM options available.

Professional 2-inch IC chip tray with 56 cavity matrix, made from recyclable ABS material. Features ESD protection, high temperature resistance, and 0.2 mm flatness precision. ROHS certified with custom OEM/ODM options available for electronic component packaging applications.

Professional 2-inch ESD anti-static IC chip tray with permanent electrostatic dissipation (10⁴-10¹¹Ω), 0.2mm flatness, and ROHS certification. Ideal for bare die, CSP, and wafer scale packaging with excellent mechanical strength, heat resistance, and chemical corrosion protection. Available in multiple sizes with OEM/ODM customization options.

Professional anti-static IC chip tray with 6.0mm design meeting international standards. Features 70-cavity matrix, 1.0×10⁴-1.0×10¹¹Ω surface resistance, and 0.3mm flatness. Ideal for semiconductor wafers, electronic components, and optical devices with custom OEM/ODM options available.

Precision-molded 2x2 inch waffle tray for semiconductor thermal processes. Features 500 cavities, anti-static resistance 1.0x10e4-1.0x10e11Ω, and high-temperature PC material. RoHS certified, stackable, and automation-ready. Supports OEM/ODM customization with fast delivery.

Small lightweight ESD plastic trays with anti-acid properties for electronic component packaging. Features 2-4 inch sizes, 0.2-0.3mm flatness, and permanent anti-static protection. ISO certified manufacturer with custom OEM/ODM options for semiconductors and embedded systems.

Factory-made ESD IC chip tray with excellent flatness for automated handling. Features 3.5×6.6×2.5mm pocket size, multiple material options, and custom OEM capabilities. Ideal for semiconductor, embedded systems, and electronic component storage with 10+ years manufacturing experience.

Custom ABS waffle pack tray designed for single QFP IC chips. Features 5.5mm thickness, permanent antistatic protection, and excellent flatness for automated handling. Customizable size and cavity. Durable, recyclable, and stackable for efficient storage and transport.

Custom ESD safe waffle pack tray for IC chips and optical devices. Made from PC with surface resistance 1.0x10e4-1.0x10e11Ω. Flatness max 0.2mm. Accepts OEM/ODM. ROHS and SGS certified. Free samples available.

Professional ESD conductive IC chip trays provide permanent antistatic protection for sensitive electronic components. Featuring 100-piece packs with excellent mechanical strength, chemical resistance, and automated equipment compatibility. ISO and RoHS certified with custom color options and 5-7 day sample lead time.

Environmentally compliant IC chip trays with ROHS certification and anti-static protection (10⁴-10¹¹Ω surface resistance). Available in 2", 3", and 4" sizes with high temperature and corrosion resistance. Features matrix design for maximum capacity and edge chamfer for stacking accuracy. OEM/ODM services available.

Custom biodegradable semiconductor trays with ESD protection for IC and electronic components. Features 7.0×5.9×2.0mm pocket size, ISO certification, RoHS compliance, and custom design options. Durable, reusable, and eco-friendly packaging solutions for automation equipment compatibility.

Professional antistatic PC waffle pack chip trays featuring 10⁴-10¹¹ ohm surface resistance for superior ESD protection. These eco-friendly trays offer excellent mechanical strength, heat resistance, and chemical corrosion protection. Customizable in size, material, and color with CAD design support. Ideal for electronic component storage, packaging, and transportation with 10+ years OEM experience.