IC Chip Tray

Durable colored anti-static waffle pack tray for precision electronic components. Enables batch classification by color, reduces errors, and eliminates static. Custom sizes, colors, and logos available. ISO and RoHS certified. 12 years export experience.

Professional ESD tray designed for inverted components with 100PCS capacity and 50.7×50.7×4mm dimensions. Features anti-static protection (1.0×10⁴-1.0×10¹¹Ω), 0.2mm flatness, and ROHS certification. Ideal for wafer dies, PCBA modules, and optical devices with OEM/ODM customization options available.

Permanently antistatic ABS tray for storing IC components. Features 10e4-10e11 ohm surface resistance, impact resistance, and heat resistance. Customizable sizes and OEM/ODM service available. ROHS certified.

Professional permanent anti-static chip trays designed for tiny semiconductor dies with 50.7×50.7×4mm dimensions and 0.46×0.46×0.23mm cavity size. Features 1.0×10⁴-1.0×10¹¹Ω surface resistance, MAX 0.2mm flatness, and ROHS compliance. Ideal for wafer die, PCBA modules, and electronic component packaging with OEM/ODM customization available.

Professional ESD-protected waffle pack trays designed for semiconductor and electronic component packaging. Withstands high temperatures from 120°C to 220°C without deformation. Features 21.8x20.8mm pockets, ROHS/SGS certifications, and custom OEM options. Durable, reusable, and eco-friendly construction for industrial applications.

Green anti-static IC tray for micro electronic components. Made of high-temperature ABS with surface resistance 10e4-10e11 ohms. Customizable size, OEM/ODM accepted, ROHS certified. Ideal for ESD-safe storage and transport.

Durable PC anti-static tray with 64 cavities (8x8). Surface resistance 1.0x10e4-1.0x10e11Ω. SGS, ROHS approved. Customizable color, size, and ESD properties. Ideal for semiconductor and SMT handling.

Durable PC anti-static tray holds 32 small motor IC chips. Custom cavity design ensures secure loading. ISO & RoHS certified. 10+ years export experience. OEM/ODM accepted. Ideal for semiconductor and electronic component storage and transport.

Durable black ABS waffle pack tray with 20x20 matrix (400 cavities) for optical device packaging. Features 0.95x1.25x0.46mm cavity size, flatness ≤0.2mm, and surface resistance 1.0x10e4-1.0x10e11Ω. ROHS certified, OEM/ODM available. Lightweight, recyclable, and cost-effective for semiconductor transport.

Precision-molded PC waffle tray with 68 cavities (14x3.32x0.3mm) for safe storage of small bare die. Features high cleanliness, flatness ≤0.2mm, and antistatic resistance. ISO and RoHS certified. Accepts OEM/ODM customization. Ideal for semiconductor and photoelectric applications.

Durable, lightweight IC chip tray with 180 pockets (7.05x2.9x1.07mm each). Customizable design ensures perfect fit for various chips. ISO 9001, SGS, ROHS certified. Ideal for semiconductor, medical, and maintenance applications. MOQ 1000 pcs.

High-precision 2-inch waffle pack tray with Moldflow-optimized design for superior flatness and dimensional accuracy. Features permanent ESD protection, 250 pockets, and RoHS/ISO certification. Ideal for die sorting, inspection, and automated handling. Supports OEM/ODM customization.

Permanent ESD safe conductive ABS waffle pack tray for microchip storage and transport. Features 100 precision cavities, dimensional stability, and non-sloughing cleanroom readiness. RoHS and ISO certified. Supports OEM/ODM customization for automated handling and secure stacking.

Durable ESD-safe tray with precision cavity layout protects delicate IC chips from shifting and electrostatic damage. Resistance 1.0×10⁴-1.0×10¹¹ Ω, max warpage 0.21mm. ISO certified, RoHS compliant. Custom cavity sizes and OEM/ODM available for automated packaging lines.

ESD-safe waffle pack for IC chips, 2 inch size with 49 pockets. Flatness max 0.2mm, surface resistance 1.0x10e4-1.0x10e11Ω. Made of conductive ABS/PC, ROHS certified. Accepts OEM/ODM customization for safe transport and handling.

Engineered with precision cavities to secure delicate ICs, offering reliable ESD protection from 1.0x10⁴ to 1.0x10¹¹ Ω. Durable, wear-resistant design supports automated production. Fully customizable cavity layout. ISO certified and RoHS compliant for industrial use.

Durable high-temp ESD waffle tray with precision grid design for secure IC chip handling. Features 272 cavities, 1.0×10⁴–1.0×10¹¹ Ω resistance, and ISO/RoHS compliance. Supports fully customized cavity sizes and layouts for automated packaging and cleanroom workflows.

Permanently conductive ABS/PC trays with precision ribbed matrix for crush-proof stacking. 100 cavities per tray, 10^4-10^11 Ω resistance. RoHS certified, OEM/ODM supported. Ideal for fragile semiconductor component shipping.

Permanent antistatic ABS waffle pack with 56 cavities (8.22x1.88x0.30mm). Anti-migration design, RoHS compliant, and cleanroom-ready. Ideal for high-speed SMT and die sorting. Accepts OEM/ODM customization.

Permanent antistatic PC waffle pack tray with 56 precision cavities for safe storage and transport of small, fragile parts. Features superior flatness, RoHS/ISO compliance, and OEM/ODM customization. Ideal for semiconductor, medical, and aerospace applications.