Shenzhen Hiner Technology Co., Ltd.
                                                                                                           
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13 Years
Since 2013
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JEDEC IC Trays
JEDEC Matrix Trays
IC Chip Tray
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Waffle Pack Chip Trays
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Show Factory Tooling Details For JEDEC TRAY

Workshop Display
2023-10-07
Tooling Process JEDEC Tray Factory Manufacturing
Discover the Tiny Modules 4 Inch Waffle Pack Chip Trays, designed for ESD stability and anti-static protection. Perfect for transporting and handling bare dies, these trays are customizable, high-temperature resistant, and compliant with international environmental standards. Ideal for wafer dies, PCBA modules, and electronic component packaging.