Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices

Sample Display

2024-06-13

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Discover the Black MPPO ESD Component Tray, 7.62mm thick, designed for BGA IC Devices. Secure, stackable, and fully traceable, this JEDEC tray streamlines logistics in fast-paced manufacturing environments. Ideal for various IC packaging solutions.