Embedded fingerprint module

JP-0A02 Press Type Capacitive Fingerprint Sensor Module Product Overview The JP-0A02 Press Type Capacitive Fingerprint Sensor Module is the circular variant of the JP-0A0 series, featuring a round semiconductor capacitive sensor designed for seamless integration into compact and aesthetically refined products. Built around a high-speed processor and advanced fingerprint algorithm, this module supports fingerprint capture, feature extraction, template storage, and 1:1 or 1:N

JP5000 Planar Press Capacitive Semiconductor Fingerprint Module Product Overview The JP5000 Planar Press Capacitive Semiconductor Fingerprint Module is a high-capacity biometric solution engineered for applications requiring large-scale fingerprint storage and fast identification. Built around a high-speed DSP processor and a proprietary semiconductor sensor, this intelligent module supports fingerprint enrollment, image processing, feature extraction, template storage, and 1

JP-0A0 Press Type Capacitive Fingerprint Sensor Module Product Overview The JP-0A0 Press Type Capacitive Fingerprint Sensor Module is a high-reliability biometric authentication solution featuring a semiconductor capacitive sensor with 192 × 192 pixel resolution and 508 dpi image quality. Designed for press-type fingerprint acquisition, this module captures high-quality fingerprint images in under 0.25 seconds, supporting both 1:1 verification and 1:N identification with a