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High Thermal Conductive Liquid Silicone Glue Electronic Potting Compound Quick Detail: Name Epoxy Resin 1212 Advantage High Gloss,No yellow,Crystal Clear, Low odor, Self Levelling Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: Aorun 1212 is supplied as two component silicone rubber material, which can be either room temperature or heat cured, and it can be heated accelerated for faster cure. This

Wholesale Two Components Liquid Gap Filler Ab Glue Potting Compound Thermal Conductivity Quick Detail: Name Epoxy Resin AR83 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: Thermal conductive potting glue is a low-viscosity two-component silicone potting material. This product has good fluidity, does not produce small molecules

Conductive Liquid Silicone Glue Silicone Rubber Sealant/Electronic Potting Compound Quick Detail: Name Epoxy Resin AR85 Usage EConstruction, Transportation, Electronic Mixing Ratio A: B =1:1 (By weight) Hardening conditions 25 ℃×4H or 65℃×1.5H touch dry, 8H full dry Description: AR85ab is a two components polyurethane system,can be cured under normal temperature and high temperature, it forms a very high gloss and transparent coating to its applications. Application: AR85AB

Chemical Adhesive Conductivity Potting Glue Structural Adhesive For Power Battery Quick Detail: Name Epoxy Resin 1357 Usage Footwear & Leather, Woodworking, Other Mixing Ratio A: B = 1:1 (By weight) Curing time 6-8 hrs at room temperature 1.5 hrs at 60 ℃ 50 mins at 90 ℃ 24hrs ,full cure Product Features (1:1): 1. Two-part 1:1 mixture addition type silicone adhesive 2. Low hardening shrinkage 3. Excellent electrical insulation in high temperature and stability 4. Moisture

Hot Products 2022 Appliance Can Be Used In Electronic Component Potting Material Quick Detail: Name Epoxy Resin AR35 Usage Electronic Mixing Ratio A: B =1:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: AR35(1:1) is used on all kinds of componets of potting sealing and protection. It can be deeply cured, and with good liquidity, UV resistance, weather resistance, rain

Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin AR44 Usage Construction, Fiber & Garment, Transportation Mixing Ratio A: B =3:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: Aorun potting material for electronic components AR44 is a AB glue, rigid type, fire rated epoxy resin. It is designed specially for potting

Aorun LED/PCB Electronic Potting Silicone Glue Double Component Adhesive Quick Detail: Name Epoxy Resin AR89 Usage Electronic Mixing Ratio A: B =1:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: AR89 potting and encapsulating compounds consists of epoxies and silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength,

Epoxy Resin AR76 High Temperature FIBERGLASSING Casting Bonding Electrical Potting Quick Detail: Name Epoxy Resin AR76 Usage Epoxy floor coatings Mixing Ratio A: B =3:1 (By weight) Advantages Fine flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: potting glue potting material has moderate strength and good elasticity. It has excellent water resistance, heat resistance, mold resistance, shock resistance, acid

1:1 Two Component Silicone Thermal Potting Compound Adhesives Silicone Ab Glue Quick Detail: Name Epoxy Resin 1372 Advantage High Gloss,No yellow,Crystal Clear, Low odor, Self Levelling Mixing Ratio A: B =1:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: Aorun 1372 is two-component solvent-free type flame retardant room temperature curing epoxy potting adhesive with high thermal conductivity, cured at room or heat

Silicone Rubber Thermal Glue Potting Compounds Pouring Sealant For Potting Electronic Quick Detail: Name Epoxy Resin 1477 Usage Construction, Fiber & Garment, Footwear & Leather, LED Mixing Ratio A: B =1:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicone systems. Our products show excellent electrical conductivity, high adhesion strength, thermal resistance and high chemical resistance. Potted and encapsulated

Epoxy Resin AB Glue Epoxy Potting Compound For Electronic Components Encapsulation Quick Detail: Name Epoxy Resin 1311 Usage Epoxy floor coatings Mixing Ratio A: B =2:1 (By weight) Applications Epoxy floor coatings,Electronic component potting epoxy compound Description: silicones systems. Our products feature outstanding electrical insulation properties, superior adhesive strength, thermal conductivity and excellent chemical resistance. Potting and encapsulating compounds

Aorun-2518 black potting compound AB glue driver pcb electronic two component silicone potting mix adhesive potting compound Quick Detail: Name Potting glue Application PCB, electronic components, sensor, cable, wire, Type Epoxy two-component Function 1.Comply with American UL standard, 94V0 grade, UL number: E513688 2.Low viscosity, good fluidity, easy to penetrate; 3.moderate curing speed; thermal conductivity between 1.2~1.5. 4.After curing, no bubbles, smooth surface,