Electronic Heat Sink

High power inverter heat sink with bonded fin design for superior thermal performance. Flexible pitch and size up to 1000mm width. AL6063 T5 material, lightweight, and mold-free manufacturing. Ideal for IGBT, UPS, and LED cooling. 20+ years experience.

Custom bonded fin heat sink with flexible pitch and height up to 200mm. Made from AL 6063 T5 with optional anodizing. Ideal for IGBT, LED, and inverter cooling. 20+ years experience, rapid sample delivery within 1 week.

Custom aluminum heat sink for inverters, rectifiers, and VFDs. Made from AL6063 T5 with flexible sizing up to 1000mm width. Features bond fin technology, CNC machining, and anodizing. Ideal for high-power electronics cooling. Samples available in 1 week.

Custom aluminum heat sink extrusion with anodized anti-oxidation surface. Ideal for electronics cooling, renewable energy, and telecom. Supports laser cutting, bending, and tapping. Accepts .stp/.dxf/.dwg/.pdf drawings. Sample lead time 7 days.

High-efficiency square heat sink made from alloy 6063/6061 T5/T6. Features anti-corrosion anodized finish and CNC precision. Ideal for LED, automotive, and computer cooling. Fully customizable size, color, and surface treatment. OEM/ODM supported.

Custom bonded fin heat sink up to 1000mm width, 200mm height. Flexible pitch design, no mold needed. Ideal for IGBT, UPS, LED, and inverter cooling. Sample within 1 week. 20+ years experience.

High power bonded fin heat sink with heat conductive epoxy. Flexible pitch, height, and width without molds. Ideal for LED, IGBT, and inverter cooling. Custom sizes up to 1000mm width. 20+ years experience. Samples available in 1 week.

High-performance bonded fin heat sink for inverters and VFDs. Made of AL 6063 T5 with flexible pitch and size options. Features no-mold manufacturing, rapid sample delivery, and over 20 years of experience. Ideal for IGBT, UPS, and LED cooling systems.

Custom bonded fin heat sink, 365x60x400mm, made of AL 6063 T5/1060. Flexible pitch and size without molds. Ideal for cooling high power devices like IGBT, UPS, and LED lighting. 20+ years experience, samples available in 1 week.

Bonded fin heat sink made of AL6063 T5/AL1100, size 260x88x200mm. Flexible pitch and height, no mold needed. Ideal for high-power devices like IGBT, UPS, and inverters. Custom sizes available, samples in 1 week.

Custom bonded fin heat sink for 22KW VFD and power devices. Made of AL6063 T5 with flexible pitch and height. No mold required, lightweight, and ideal for IGBT/UPS cooling. Supports anodizing, sandblasting, and CNC machining. 20+ years experience.

Custom bonded fin heat sink made without mold, offering flexible pitch, height, and width. Ideal for cooling high power devices. Supports AL6063 T5 and AL1100 materials. Sample delivery within 1 week. 20+ years experience.

Customizable bonded fin heat sink in AL6063 T5 or AL1060, max width 1000mm. Features flexible pitch, no mold cost, and rapid sample delivery within 1 week. Ideal for IGBT, LED, and power supply cooling with optional anodizing.

High-performance bonded fin heatsink for IGBT, VFD, and rectifier cooling. Made from AL 6063 T5 with flexible pitch and size options. No mold required, lightweight, and ideal for high-power devices. Supports custom designs, anodizing, and rapid sample delivery within 1 week.

Custom aluminum heat sink for IGBT, LED, and power supplies. AL6063 T5 material, flexible pitch and size up to 1000mm width. No mold needed, lightweight, efficient cooling. Sample within 1 week. 20+ years experience.

High-performance bonded fin heatsink for laser machinery. Flexible pitch and size up to 1000mm width. AL6063 T5 aluminum with black anodizing. No mold needed, lightweight, and ideal for high-power devices. 20+ years experience, rapid sample delivery.

High-efficiency aluminum heat sink (AL6063/1100) for welding machines and inverters. Flexible pitch design, no mold needed. Supports black anodizing, CNC machining, and rapid sample delivery within 1 week. 20+ years of manufacturing expertise.

Custom bonded fin heat sink made of AL 6063 T5 with flexible pitch and size options up to 1000mm wide. Ideal for LED, IGBT, and UPS cooling. Features black anodizing, CNC machining, and 20+ years of manufacturing expertise. Samples available in 1 week.

High power bonded fin heatsink for UPS/IGBT cooling. Flexible pitch design, no mold needed. AL6063 T5 material with anti-corrosion silver finish. Custom sizes up to 1000mm width. 20+ years experience. Samples available in 1 week.

High power IGBT heat sink made of AL 6063 T5 with anti-oxidation treatment. Flexible pitch and size customization up to 1000mm width. Ideal for inverters, welding machines, and UPS systems. Sample delivery within 1 week. 20+ years manufacturing experience.