SMT Reflow Soldering Machine
UV LED Curing Oven for PCB Conformal Coating 6KW/12KW
Customized UV LED OVEN For HumiSeal UV40 LED UV Curable Conformal Coating Key Specifications Attribute Value Control system PLC +Kunlun Tongtai Conveyor speed 0.3-2.5M/min LED The type of light source UV LED lamp beads LED The size of the light source 420*320mm LED Main peak wavelength 395nm LED The light intensity of the light source 6KW/12KW LED life >20,000 hours Dimensions L1500*W1010*H1500mm Principle and Application The UV-LED curing oven instantly cures UV-sensitive
Planetary Centrifugal Defoaming Mixer Automatic Solder Cream Paste Mixing Equipment
Product introduction: Automatic Solder Paste Mixer makes solder paste move downward constantly through centrifugal force generated by revolution and cooperation with energy from rotation at 45 degree angle of axis of revolution. Solder paste located in the tank bottom makes upward movement from the surrounding, which forms a tornado-funnel shaped stirring action, and it can stir, soften and de-foam the solder paste with appropriate viscosity. Solder paste has good wet-ability
Automatic Solder Cream Mixing Machine Blender Lead Free Solder Paste Mixer
Product introduction: Automatic Solder Paste Mixer makes solder paste move downward constantly through centrifugal force generated by revolution and cooperation with energy from rotation at 45 degree angle of axis of revolution. Solder paste located in the tank bottom makes upward movement from the surrounding, which forms a tornado-funnel shaped stirring action, and it can stir, soften and de-foam the solder paste with appropriate viscosity. Solder paste has good wet-ability
Automatic Soldering Solder Paste Mixer SMT Solder Cream Mixing Equipment 1000g
Product introduction: Automatic Solder Paste Mixer makes solder paste move downward constantly through centrifugal force generated by revolution and cooperation with energy from rotation at 45 degree angle of axis of revolution. Solder paste located in the tank bottom makes upward movement from the surrounding, which forms a tornado-funnel shaped stirring action, and it can stir, soften and de-foam the solder paste with appropriate viscosity. Solder paste has good wet-ability
Convection SMT Reflow Oven 1826 MK5 with Temperature Range of 60-350°C and 183" 465cm Length
The latest breakthroughs associated with the Mark 5 reflow system now provide you with an even lower cost-of-ownership. Heller's new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5 system not only the premier reflow soldering system but the best overall value in the industry. Overview: Suitable Heating Technologies For Lead-Free Wave Soldering Processes Temperature Adjustment Range: 60℃-350℃ Max Temperature:
Heller 1810 MK5 10 Zone SMT Reflow Oven for Lead Free Soldering of PCBs 2" 22" 5 56 cm Wide
Gen5 Waterless Cooling and Flux Separation System – Heated Cooling Module in 1st Cooling Zone for Controlling Cooling Slope – Enhanced Waterless Cooling Modules for Low Product Exit Temperature. Complete Computer Control System including: Flat Panel Color Monitor & Keyboard Support Arm ECD CPK & SPC data and alarm logging with timed download or printout capability 5 Thermocouple “Real Time” profiling Complete KIC & ECD Profiling & Storage Software including the following
Used Heller 1809 MK5 SMT Reflow Oven Mark V series Reflow Soldering Machine
The 1800 reflow oven models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. Highest Yields and Tight Process Control The most efficient heat transfer from extra high volume, high-velocity,
Modular Hot Air Reflow Oven SMT 16-Zone Forced Convection
Modular Design Hot Air Reflow Oven SMT Lead Free Fully Forced Air Convection Product Specifications Attribute Value Dimensions L5520*1430*1530 mm Zones constitute Upper8, bottom8, 2 cooling zones Heating method Fully forced air convection Temperature controlling PID close-loop control, SSR drive Temperature range Ambient---300℃ Temperature accuracy ±1 ℃ Conveyor method Mesh belt and chain conveyor Max PCB width 400mm Hood Opening Motorized Options Center rail support Product
LED Nitrogen SMT Reflow Soldering Machine Rail Support Fully Forced Air Convection
Smt Reflow Machine Led Reflow Soldering Machine Rail Support Tin Soldering Machine Features: HR Series High End/Nitrogen Reflow Soldering Machine ¤ Suitable For High End Products/Critical Process Criteria ¤ 6, 8, 10, 12 Heating Zones Available ¤ Single/Dual Lane Configuration Available ¤ Option Of Center Rail Support ¤ Choices Of Air/Nitrogen Structure ¤ High performance Of Heat Preservation/Power Saving ¤ Setpoint Difference Of 90°C Between Adjacent Zone ¤ Advance
Smt Vitronics Reflow Oven 8 Zones Nitrogen N2 Lead Free Design
Smt Vitronics Reflow Oven 8 Zones Nitrogen N2 Lead Free Reflow Oven Features: HR series micro cycle solder-reflow machines adopt a pipe nozzle comparable with that made by ERSA Germany. The thermal efficiency of pipe nozzles construction (example: ERSA type hot wind construction) is higher than that of perforated plate construction (example: HFLLER type hot wind construction). Therefore can effectively solve problems such as interval interference and dead angle of conveyor.
8 Zones SMT Reflow Soldering Machine Oven Vacuum Modular Design
Vacuum Reflow Oven Smt Reflow Soldering Machine Solder Reflow Oven Equipment Features: HR Series High End/Nitrogen Reflow Soldering Machine 1. Modular design of temperature zone makes maintenance convenient and quick. 2. Self-extending guide rail design further prevents deformation from causing the board to fall off. 3. Segmented heating method saves energy and reduces power consumption. 4. One extended forced constant air cooling zone at the top and bottom 5. Flux recovery