SMT AOI Machine

High-speed 3D SMT AOI machine with 12MP color camera and 10μm resolution. Inspects PCBs from 50x50mm to 400x500mm, detects defects like missing components and soldering issues. Features dual DLP light source, phase shift technology, and supports Gerber/ODB++. ISO9001 certified, customizable, and negotiable pricing.

High-speed automatic optical inspection machine with 5MP color camera and deep learning detection. Inspects PCBs from 50x50mm to 510x460mm, supports 01005 chips. Features 3D solder paste inspection, 0.3mm pitch, and 3 FOV/s speed. Ideal for precision SMT assembly.

High-speed automatic optical inspection machine with 12MP color camera and 10um resolution. Inspects PCBs from 50x50mm to 510x460mm, thickness 0.3-10mm. Features deep learning detection, 3 FOV/s speed, and ISO9001/ISO14001 certification. Ideal for CHIP and DIP components.

High-speed automated optical inspection system with 12MP camera and 10um resolution. Detects defects in PCBs 0.3-10mm thick at 0.23sec/FOV. Features deep learning, ISO9001 certified, and customizable component height. Ideal for automotive, aerospace, and medical electronics manufacturing.

Advanced 3D solder paste inspection system with 12MP camera and deep learning detection. Inspects components as small as 0603, PCB thickness 0.3-10mm. Manual width adjustment, 800mm/s speed, ISO9001 certified. Customizable height, competitive price, 3-week delivery.

High-speed SMT AOI machine with 800mm/s movement and 0.23sec/FOV for fast, accurate PCB inspection. Detects missing components, polarity, and soldering defects. Supports PCBs 0.5-6mm thick. ISO9001 certified, customizable, with 3-month warranty.

High-speed 3D SMT AOI machine with 12MP camera and 800mm/s movement for precise PCB inspection. Inspects PCBs from 50x50mm to 510x460mm, thickness 0.5-6mm. Features machine learning, phase shift technology, and ISO9001/ISO14001 certification. Customizable and reliable for automated quality control.

High-speed 2D AOI with 5MP industrial camera and 15um resolution. Detects 0402 components, supports deep learning, and offers MES data integration. Customizable height and labor-saving multi-line review mode for efficient PCB inspection.

High-speed 2D automated optical inspection system with deep learning and image processing. Detects CHIP 01005 and DIP solder joints. Features 12MP camera, 10um resolution, and 3FOV/s speed. Supports MES interface and labor-saving mode. Customizable height and PCB thickness up to 10mm.