AOI Tester

Product Description: With its Ethernet and USB connectivity options, this AOI tester is the perfect tool for quick and efficient inspection of your PCBs. The Ethernet connectivity ensures that you can easily and remotely access the inspection results, while the USB connectivity option gives you the flexibility to transfer the data to other devices for further analysis. The AOI equipment is designed to be user-friendly and easy to operate. Its automatic optical inspection

Product Description: The AOI Tester boasts an inspection speed of up to 60cm²/s, providing efficient and accurate results. Its operating system is Windows, which makes it user-friendly and easy to operate. It also has a power supply of AC 100-240V, 50/60Hz, making it compatible with different electrical systems. As an AOI machine, it can detect defects such as missing components, misaligned parts, and soldering issues. It is an effective tool in ensuring that the products

M20 Series Mini LED appearance inspection Model M2012 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 12MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Flying shoot:10FOV/s Computer Configuration

M20 Series Mini LED appearance inspection Model M2020 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 20MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Computer Configuration

M20 Series Mini LED appearance inspection Model M2065 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing, machine learning Optical System Camera 65MP 25MP 20MP 12MP Lens High resolution bi-telecentric lens Resolution 4μm(2.4μm~10μm optional)RGB(Customisable) Light Source RGB customizable Efficiency Stop then go:3FOV/s Flying

M20EL Series Mini LED luminescence inspection Model M1020EL Inspection Inspection items Bad die, over luminescence, under luminescence, chroma anomaly Inspection method Image processing, machine learning Optical Camera 20MP Lens FA Resolution 18μm 75μm Light Source RGB Computer configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6G SSD:250G, HDD:2T Monitor 22 "LED Operating System Windows 10 Professional 64-bit/Ubuntu Performance Maximum allowable component height Upper

Model RD30K Basic Function Function Defective die removing, residues cleaning, solder paste/adhesive printing, die bonding, solder curing, luminescence inspection Wafer size 3x5mil-20x20mil Substrate compatibility FR-4, BT substrate, glass substrate, FPC, etc. Maximum board size 380mmx280mm Removing Removing,method Physical Residue cleaning Direct removal + heating suction Height measurement Laser measurement 0.001mm Printing Motion XYZ (linear way) Adhesive compatibility

Testing Program Gold Wire lnspection: Gold Ball Size, Solder Joint Offset,Eccentric Ball GolfSolder Joint Non-Stick, Solder Joint Bridging, Missing BallPlanting, Solder Joint Adhesion, Solder Joint Foreign Objects,Loss ofAluminum, Overlapping Solder Joints, Damaged Protective Coating,BrokenSolder Joints, Loss of Gold in Gold Fingers, Large Flat Balls,Unsoldered← Wires, soldering wrong wires, missing soldering wires, broken wires, wires stepping, wires bridging, gold wires

S2020 Semiconductor wire bonding inspection Device model S2020 Detection capacity Detection items Wire bonding inspection Detection type Ball size, solder offset, solder bridging, miss planting ball, particle, solder overlap, solder break, , welding wrong wire, wire break, wire collapse, wire bridging, wire residue, welding wire interleaving Optical system Camera 20MP Telecentric lens telecentric optical lens Resolution 4um(2.4um~4um optional) illuminant RGB(can be customized

M20M series Mini LED PCB pad measurement Model M2020MM Detection capacity Inspection items Mini LED PCB pad measurement Inspection method Global calibration, pad global alignment Optical system Camera 20MP telecentric lens High resolution bi-telecentric lens Resolution 4um (2.4um~5um optional) Light Source RGB(Customizable) Efficiency Four side detection 20s/pcs Computer Configuration PC CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB, SSD:250G, HDD:2T Monitor 22 "LED Operating