Multilayer PCB

High-reliability multilayer PCB with immersion gold finish, up to 1500x800mm size, and 1.60mm thickness. Features green solder mask, blind/buried vias, and RoHS compliance. Ideal for complex electronics in telecom, automotive, and aerospace. Customizable with various solder mask colors and silkscreen options.

High power 8-layer PCB with FR4 material, 1.6mm thickness, immersion gold surface, and 0.2mm minimum aperture. Optimized for noise reduction and signal integrity in DAQ cards. Custom options available.

This 6-layer FR4 PCB features 1.6mm thickness and immersion gold surface treatment. Designed for SSD applications, it offers optimized thermal management with dedicated power and ground planes, plus 0.2mm minimum aperture for high-speed signal integrity.

8-layer HDI PCB with 32u gold finger and immersion gold finish. FR-4 material, 1.0mm thickness. Ideal for memory boards. Supports custom stack-ups and high-density interconnects for reliable performance.

High-reliability multilayer PCB with FR4 base material, blind/buried vias, and RoHS compliance. Ideal for banking, telecom, and industrial systems. Supports custom silkscreen colors and PCBA service. Durable, compact, and performance-driven.

High-density 1.60mm FR4 multilayer PCB with immersion gold finish. RoHS compliant, supports blind/buried vias. Ideal for banking, telecom, and industrial applications. Customizable thickness 0.2-6.0mm. FOB trade terms available. Provide Gerber file for quick quote.

High-reliability multilayer PCB built with durable FR4. Supports blind/buried vias, multiple soldermask colors, and sizes up to 1500x800mm. RoHS compliant with PCBA service available. Ideal for banking, industrial, and medical applications. Customize per your Gerber file.

High frequency 6 layer PCB combining Rogers 5880 and FR4 for optimal RF performance and cost. Features 35um copper, ENIG finish, and 1.8mm thickness. Ideal for microwave and high-speed applications up to 40 GHz. Custom stack-up available.

8-layer HDI PCB featuring blind vias for high-density interconnects. FR4 material, 2.0mm thickness, ENIG finish. Supports microvias and via-in-pad. Ideal for compact electronics. Custom stack-up and quick 10-day sample delivery.

High-density 12-layer PCB with FR4 material, 2oz copper, and 1.25mm thickness. Supports blind vias, 3/3mil trace/space, and 0.15mm min hole. Ideal for medical equipment and complex electronics. Fast prototype delivery in 6 days.

High-density 16-layer PCB with gold finger finish and 2.0mm thickness. Features Fr4 TG180 material, 0.2mm min hole, and 0.1mm outer line width. Ideal for telecom, aerospace, and industrial controls. Supports custom stack-ups and one-stop manufacturing.

6-layer high frequency PCB using Rogers 3003 + FR4 hybrid stackup. 1.0mm thickness, ENIG surface finish, 1oz copper. Ideal for communication, aerospace, and telecom applications. Supports custom stackups and HDI options.

High-density 14-layer FR4 PCB with via-in-pad technology for fine pitch BGA. Features 4mil trace, 0.15mm min hole, and gold plating. Enhances thermal dissipation, routing density, and signal integrity. Ideal for compact, high-speed designs.

High frequency 6 layer mixed stack up PCB combining Rogers 4350B and FR4. Features 1.2mm thickness, 1oz copper, and gold surface finish. Ideal for RF antennas, power amplifiers, and base stations. Offers low dielectric loss and tight DK control. Custom stack up and 24hr sample service available.

This 14-layer Fr4 PCB features 4.8mm thickness, immersion gold finish, and precise 50/75 ohm impedance control. Ideal for industrial control systems, it offers high reliability, custom stack-ups, and supports complex designs for demanding applications.

This 6-layer FR4 PCB features blind and buried vias for high-density RF designs. With a 1.6mm thickness, immersion gold finish, and 0.1mm minimum aperture, it ensures excellent signal integrity. Ideal for telecommunications and aerospace applications.

High-performance 13-layer PCB using Panasonic Megtron6 for 5G MMW applications. Features 2mm thickness, 2OZ copper, and ENIG finish. Ideal for telecommunications, aerospace, and high-speed digital systems. Supports custom stack-ups and rigorous quality testing.

Manufacturer of 8-layer FR4 PCBs at 5mm thickness with ENIG finish. UL, ROHS, ISO, IPC certified. 20 years experience in high Tg multilayer PCB production. Supports BGA, HDI, and custom stack-ups. Lead time 3-10 working days.

High-quality multilayer PCB with thickness range 0.2mm to 6.0mm, ideal for banking systems. Features immersion gold finish, multiple soldermask colors, and custom options. Durable, reliable, and suitable for prototyping and high-performance electronics.

High-performance 4-layer multilayer PCB assembly using Rogers 4350 core and 4450 prepreg. Features immersion gold finish, 1oz copper, and green solder mask. Ideal for RF, telecom, and aerospace applications requiring signal integrity and durability.