HDI PCB
High TG HDI PCB Board 1.6mm Thickness Power Supply for Automated Equipment
High TG HDI PCB board designed for power supply in automated production equipment. Features 1.6mm thickness, immersion gold surface, and 0.08mm line width/spacing. Ensures signal integrity with controlled impedance and differential pair routing. Ideal for compact, high-density applications.
ONEpcb FR4 HDI PCB Board 0.1mm Min Hole 8mil Line Width for High Performance
Certified ISO9001, UL, and RoHS, this HDI PCB offers 0.1mm min hole and 8mil line width for high-density interconnects. Supports Gerber files, customizable base materials, and white legend for clarity. Ideal for mobile, medical, and aerospace applications.
CEM-3 HDI PCB Board 0.1mm Min Hole 2.4mm Thick High Reliability for Harsh Environments
High-density interconnect PCB with 0.1mm min aperture and 2.4mm board thickness. Supports FR4, ROGERS, Aluminum, High TG, and CEM-3 base materials. Certified ISO9001, UL, RoHS. White legend and silkscreen for clear assembly. Ideal for aerospace, automotive, and medical applications.
Custom OEM HDI PCB Green Solder Mask 8mil Line Width 0.1mm Aperture
High-density interconnect PCB with 8mil line width and 0.1mm minimum aperture. Supports Gerber files, white silkscreen, and multiple base materials including FR4 and aluminum. Ideal for compact, high-performance electronics. IPC-A-600H compliant.
8mil Min Line Width HDI PCB Board 0.1mm Aperture 2.4mm Thick OEM
High-density interconnect PCB with 8mil line width and 0.1mm aperture. Supports Gerber and XYRS files. Certified ISO9001, UL, RoHS. Ideal for telecom, aerospace, and medical devices.
ONEpcb HDI PCB 2.4mm Thick 8mil Min Line Width Flying Probe Tested ISO9001 UL
High-density interconnect PCB with 0.1mm min aperture and 8mil line width. Supports FR4, ROGERS, Aluminum, High TG, and CEM-3 base materials. Certified ISO9001, ISO14001, UL, RoHS. Flying probe and fixture testing ensure reliability. Ideal for compact, high-tech electronics.
ONEpcb HDI PCB 2.4mm Thick 8mil Line Width High Density Interconnect Board
High-density interconnect PCB with 8mil line width and 0.1mm min aperture. Supports 50Ω/75Ω/100Ω impedance control. Certified ISO9001, UL, RoHS. Ideal for telecom, aerospace, and medical devices.
HDI PCB Circuit Board FR4 Base Material 2.4mm Thickness 8mil Line Width White Silkscreen
High density interconnect PCB with FR4 base material, 2.4mm thickness, and 8mil minimum line width. Certified ISO9001, UL, RoHS, and IPC-A-600H Class 2/3. Supports Gerber and XYRS files. Ideal for communication, medical, and aerospace applications. Custom options available.
Customized 2.4mm HDI PCB Board with White Legend Gerber Files 0.1mm Min Hole
High-density interconnect PCB with 2.4mm thickness and 0.1mm minimum hole size. Supports 50-100Ω impedance control. Meets IPC-A-600H Class 2/3 standards. White legend on green solder mask. Accepts Gerber files. Custom options available. ISO, UL, RoHS certified.
OEM HDI PCB 0.1mm Aperture 2.4mm Thick for Fixture Testing Production
High-density interconnect PCB with 0.1mm min aperture and 2.4mm thickness for fixture testing. Features impedance control (50Ω/75Ω/100Ω), 8mil line width, and supports Gerber/XYRS files. Certified ISO9001, ISO14001, UL, RoHS. Ideal for compact, high-performance applications.
Green HDI PCB 0.1mm Minimum Aperture Solder Mask White Silkscreen ISO9001 UL
High-density interconnect PCB with 0.1mm min hole and aperture, green solder mask, and white silkscreen. Certified ISO9001, ISO14001, UL, RoHS. Customizable OEM design for aerospace, medical, telecom, and industrial applications.
6 Layer FR408 1.6mm ENIG Industrial Control HDI PCB Board 450x450mm
High-density 6-layer HDI PCB with 1.6mm thickness and ENIG surface finish. Features microvias, laser drilling, and ±10% impedance tolerance for reliable high-speed signal transmission. Ideal for industrial control, automotive, and IoT applications. Custom sizes available.
4 Layer Blue HDI PCB Arduino Uno Board 225x150mm Immersion Gold
High-density interconnect PCB with 4 layers, 0.085mm line width/spacing, and immersion gold surface. Ideal for mobile, automotive, and IoT devices. Custom options available. Durable Shengyi S1000-2 substrate ensures reliability.
4 Layer Blind Buried Via HDI PCB 0.1mm Min Aperture Immersion Gold 1.6mm Thickness
High density interconnect PCB with blind and buried vias for compact designs. Features 0.1mm min aperture, 0.088mm line/space, and immersion gold finish. Ideal for mobile, medical, and automotive electronics. Supports custom stackups and impedance control.
High Precision 6 Layer Impedance Control PCB Microvias 94V0 FR-4 1.8mm
High-density interconnect PCB with 6 layers, 1.8mm thickness, and immersion gold finish. Features microvias for compact design and high-speed signal transmission. Ideal for mobile, automotive, and medical devices. Custom options available.
6 Layer ENIG FR5 HDI PCB 1.55mm 35um Copper 0.25mm Via
High-density 6-layer HDI PCB with FR5 material and ENIG surface finish. Supports 0.25mm microvias and 0.152mm trace/space for compact designs. Ideal for automotive, medical, and telecom applications. Custom stackup and impedance control available.
8 Layer Multilayer HDI PCB with Blind Vias ENIG 2.0mm Thickness FR4
High-density interconnect board featuring 8 layers, blind vias, and ENIG surface finish. Designed for compact, high-performance applications. Supports custom stack-ups and fast 10-day sample delivery. Ideal for advanced electronics requiring reliable signal integrity.
Immersion Gold HDI PCB 2 Layer Microvia Multilayer Circuit Board 1.6mm FR-4
High-density 2-layer HDI PCB with immersion gold finish and 0.1mm microvias. FR-4 material ensures durability and signal integrity. Ideal for compact electronics. Custom options available.
Car Driving Recorder HDI PCB Fr4 Base 10 Layer Circuit Board ENIG Surface 1OZ Copper 2.0mm Thickness
High-density 10-layer HDI PCB with Fr4 base and ENIG surface finish. Features 1OZ copper, 2.0mm thickness, and 2-step technology for reliable performance. Ideal for automotive electronics, offering durability and signal integrity. Custom options available.
8 Layer CEM-3 HDI PCB High Density Interconnect 1.6mm Thickness ENIG Surface Finish
This 8-layer HDI PCB uses CEM-3 material, offering a cost-effective alternative to FR-4 with similar performance. Features 1OZ copper, 6mil line width, and ENIG finish. Ideal for automotive, industrial, and consumer electronics. Supports custom impedance control and reliable high-density interconnects.