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1.9mm Height Top View 3528 Infrared Emitting Diode , Infrared Chip LED 850nm

Price Negotiable
Price: US$ 0.02-0.05 per unit (Pieces) and negotiable
MOQ: 2,000pcs/Real
Delivery Time: Negotiable
Brand: Double Light
Product Description

 

1.9mm Height Top View 3528 Infrared Emitting Diode , Infrared Chip LED 850nm

 

DL-TOP3528SIRC-2SIR120.pdf

         

       

Features:

  • Package in 8mm tape on 7" diameter reels.
  • Built in 1 LED chip.
  • Wide viewing angle.
  • Soldering methods: Reflow Soldering.
  • High performance.
  • The product itself will remain within RoHS compliant Version.

 

Descriptions:

  • The TOP3528 Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
  • Besides, lightweight makes them ideal for miniature applications. etc.

 

Applications:

  • PCB mounted infrared sensor.
  • Infrared emitting for miniature light barrier.
  • Floppy disk drive.
  • Optoelectronic switch.

 

Package Dimension:

 

 

 

Part No. Chip Material Lens Color Source Color
DL-TOP3528SIRC-2SIR120 GaAlAs/GaAs Water Clear Infrared

 

Notes:

1. All dimensions are in millimeters (inches).

2. Tolerance is ± 0.10mm (.004") unless otherwise specified.

3. Specifications are subject to change without notice.

 

 

Absolute Maximum Ratings at Ta=25℃

Parameters Symbol Max Unit
Power Dissipation PD 90 mW

Peak Forward Current

(1/10 Duty Cycle, 0.1ms Pulse Width)

IFP 1000 mA
Continuous Forward Current IF 50 mA
Reverse Voltage VR 5 V
Operating Temperature Range Topr -40℃ to +80℃
Storage Temperature Range Tstg -40℃ to +100℃
Soldering Temperature Tsld 260℃ for 5 Seconds

 

Electrical Optical Characteristics at Ta=25℃

Parameters Symbol Min. Typ. Max. Unit Test Condition
Radiant Intensity (Note 1) * Ee 8.0 15.0 --- mW/sr IF=20mA
Viewing Angle (Note 2) * 2θ1/2 --- 120 --- Deg IF=20mA
Rise Time Tr --- 20 --- nsec IF=20mA
Fall Time Tf --- 30 --- nsec IF=20mA
Peak Emission Wavelength λp --- 850 --- nm IF=20mA
Spectral Bandwidth △λ --- 45 --- nm IF=20mA
Forward Voltage VF 1.00 1.30 1.50 V IF=20mA
Reverse Current IR --- --- 10 µA VR=5V

 

Notes:

1. Luminous Intensity Measurement allowance is ± 10%.

2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

 

 

Typical Electrical / Optical Characteristics Curves

(25℃ Ambient Temperature Unless Otherwise Noted)

 

 

Reliability Test Items And Conditions:

The reliability of products shall be satisfied with items listed below:

Confidence level: 90%.

LTPD: 10%.

No. Item Test Conditions

Test Hours/

Cycles

Sample

Sizes

Failure

Judgment

Criteria

Ac/

Re

1 Reflow Soldering

TEMP.: 260℃+5℃

5secs

6mins 22pcs

IR≧U×2

Ee≦L×0.8

VF≧U×1.2

 

 

U: Upper

Specification

Limit

L: Lower

Specification

Limit

0/1
2 Temperature Cycle

H: +100℃ 15mins

5 mins

L: -40℃ 15mins

50Cycles 22pcs 0/1
3 Thermal Shock

H: +100℃ 15mins

10mins

L: -10℃ 5mins

50Cycles 22pcs 0/1
4

High Temperature

Storage

TEMP.: +100℃ 1000hrs 22pcs 0/1
5

Lower Temperature

Storage

TEMP.: -40℃ 1000hrs 22pcs 0/1
6 DC Operating Life VCE=5V 1000hrs 22pcs 0/1
7

High Temperature/

High Humidity

85℃ / 85% R.H 1000hrs 22pcs 0/1

 

 

 

Reel Dimensions:

 

Carrier Tape Dimensions:

Loaded quantity 2000 PCS Per reel.

 

 

 

Please read the following notes before using the datasheets:

1. Over-current-proof

Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change (Burn out will happen).

2. Storage

2.1 Do not open moisture proof bag before the products are ready to use.

2.2 Before opening the package, the LEDs should be kept at 30℃ or less and 90%RH or less.

2.3 The LEDs should be used within a year.

2.4 After opening the package, the LEDs should be kept at 30℃ or less and 70%RH or less.

2.5 The LEDs should be used within 168 hours (7 days) after opening the package.

2.6 If the moisture adsorbent material (silica gel) has fabled away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 60±5℃ for 24 hours.

3. Soldering Condition

3.1 Pb-free solder temperature profile.

 

 

3.2 Reflow soldering should not be done more than two times.

3.3 When soldering, do not put stress on the LEDs during heating.

3.4 After soldering, do not warp the circuit board.

 

4. Soldering Iron

Each terminal is to go to the tip of soldering iron temperature less than 260℃ for 5 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.

 

5. Repairing

Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

 

 

6. Caution in ESD

Static Electricity and surge damages the LED. It is recommended to use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company DOUBLE LIGHT ELECTRONICS TECHNOLOGY CO.,LTD
Location Room 2711, Huishang Center, Jiahui New City, No. 3027 Shennan Middle Road, Futian District, Shenzhen City, Guangdong Province China 518033
Contact Person Chen

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